Honeywell
5 December 2025

onsemi releases EliteSiC MOSFETs in T2PAK top-cool package

Enhanced thermal performance, reliability and design flexibility for automotive and industrial applications

5 December 2025

X-FAB’s XbloX accelerates time-to-market for scalable, high-performance SiC MOSFETs

Improved on-state resistance enables 30% area reduction

4 December 2025
Semi-polar epitaxial layer overgrowth improves micro-LED performance
Researchers report efficiency and power benefits
4 December 2025

Coherent expands silicon carbide platform from 200mm to 300mm

Larger-diameter, conductive SiC substrate addresses increasing thermal efficiency demands in AI data-center infrastructure

4 December 2025

Infineon enhances Electreon’s wireless in-road EV charging with silicon carbide technology

Customized SiC modules maximize power density, enabling EV to operate 24 hours a day with smaller batteries

4 December 2025

Smartphone production grows 9% in Q3/2025, driven by seasonal demand and new product releases

Full-year growth forecast of 1.6% could be lowered due to ongoing memory supply issues

4 December 2025

Filtronic awarded £1.2m funding to develop 550W Ka-band solid-state power amplifiers

UK Space Agency’s National Space Innovation Programme targets replacement of TWTAs

3 December 2025

US ITC preliminary determination finds violation of Infineon patent by Innoscience

Final determination could lead to import ban of products into USA

3 December 2025

Ascent provides space company with PV modules for power generation testing in cislunar space

Preliminary findings show promising results

3 December 2025

onsemi and Innoscience sign MoU to collaborate on speeding global rollout of GaN power portfolio

onsemi’s system integration, drivers and packaging to combine with Innoscience’s GaN wafers and high-volume manufacturing

2 December 2025

Navitas sampling 3300V and 2300V UHV silicon carbide product portfolio

Based on latest GeneSiC Trench-Assisted Planar technology and packaging

2 December 2025

NUBURU agrees to acquire Italian laser specialist LYOCON

European photonics and blue-laser systems platform strengthened, advancing Tekne-aligned defense transformation

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News Features
27 November 2025
Nitrogen-polar III-N HFETs on 200mm sapphire substrates
Researchers demonstrate MOCVD growth with a view to industrial cost-effective, large-scale production.
20 November 2025
Far-UVC LEDs on c-plane sapphire
Devices with 225nm wavelength achieve 0.12 external quantum efficiency and 0.08mW light output power.
13 November 2025
Inverting Ga-polar LEDs for N-polar benefit
Structure enables around 1000x light output over comparable N-polar LED.
30 October 2025
P-type layer etch for enhanced deep UV LEDs
Researchers achieve 10.9% increased light output power.
23 October 2025
Benefits of hexagonal mesa for micro-LEDs
Devices demonstrate enhanced current diffusion and uniformity.
16 October 2025
Indium arsenide quantum dot laser full MBE on (100) silicon
V-grooves eliminate anti-phase boundaries and reduce threading dislocations.
Feature Downloads
12 November 2025

Hidden powerhouse: South Wales, at the heart of the global compound semiconductor industry
Howard Rupprecht, managing director of CSconnected, highlights the global role of the South Wales-based compound semiconductor cluster.

3 October 2025

Boron nitride as a buffer and gate dielectric
Ultrawide-bandgap hexagonal boron nitride has been used to demonstrate AlGaN HEMTs with an ultra-high ~1011 on/off current ratio.

3 October 2025

Electrochemical III-nitride device lift-off
Plotting a route for the scalable, damage-free integration of III-nitrides onto diverse platforms for optoelectronic applications.

3 October 2025

MOCVD–MBE hybrid growth for green laser diodes
The lower growth temperature enabled by the use of MBE eases thermal budget constraints.

3 October 2025

Indium arsenide quantum dot laser full MBE on (100) silicon
V-grooves eliminate anti-phase boundaries and reduce threading dislocations.

3 October 2025

Quantum cascade lasers on a mid-infrared silicon photonic platform
Devices have achieved a T0 characteristic temperature of 180K, comparable to state-of-the-art devices on native III-V substrates.

22 September 2025

Foundry fabricated AlN-buffer HEMTs
Significant step towards industrial AlN/GaN/AlN transistors.

22 September 2025

Laser transfer of blue micro-LED arrays
Researchers in Shanghai have used rubber tape as a device carrier before thermo-compression bonding of the flipped chip array to the target substrate.