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Laser Thermal awarded DoD Phase I STTR contract
Phase I to develop metrology of high-thermal-conductivity materials and interfaces
Aixtron’s Q4 revenue grows to record €214.2m, aiding full-year growth of 36%
Systems for SiC and GaN power electronics rise from 42% to 74% of equipment revenue during 2023
Taiyo Nippon Sanso develops high-purity hydrazine gas delivery system
System compatible with BRUTE Hydrazine of subsidiary RASIRC
New Asian customer orders automated Riber MBE 412 system
System to be used to develop optoelectronic devices
Aehr ships new high-power-configured FOX-XP system for wafer-level burn-in and stabilization of silicon photonics ICs
New capabilities and value through upgrade of existing system
AXT’s quarterly revenue rebounds by 18% in Q4/2023
GaAs and InP substrate revenues recovering from inventory corrections
SK Siltron CSS secures conditional commitment from US DOE for $544m loan
Silicon carbide wafer manufacturing capacity expansion at Bay City facility to add 200 jobs
Aehr receives $23m in new follow-on orders
Demand growing for wafer-level test & burn-in of silicon carbide devices
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