AES Semigas

Samsung Foundry Forum & Safe Forum
1 December 2022

ST to qualify Soitec’s silicon carbide substrate technology over next 18 months

ST targets adoption of SmartSiC for future 200mm substrate manufacturing

22 November 2022

Veeco appoints general manager of KLA’s pattern inspection process control division to board

Lena Nicolaides brings over 20 years of experience in semiconductor capital equipment

21 November 2022

3D-Micromac’s CEO presenting at mini- & micro-LED display conference

Uwe Wagner highlighting ‘Laser technologies for the production of micro-LEDs’

17 November 2022

SUSS MicroTec launches 300mm imprint platform

MA12 Gen3 mask aligner combines lithography, micro- to nano-imprint and wafer-level stacking

16 November 2022

Plasma-Therm’s Grenoble site made EMEA HQ focused on power, wireless, memory, sensor and MEMS device development

Demo facility offers product and applications development, regional field service and technical support for etch, deposition, RTP and plasma dicing

9 November 2022

Indium Corp promotes Theo Ruas to global sales manager, Metals and Compounds

Role spans gallium tri-chloride, high-purity indium, and reclaim of indium, gallium and tin

8 November 2022

EVG launches next-gen 200mm EVG150 automated resist processing platform

Redesign boosts module capacity for higher throughput and improves architecture for reduced tool footprint

7 November 2022

Aixtron shipment pushouts in Q3 to lead to record revenue in Q4

Booming GaN and SiC power electronics drive full-year 2022 order and margin guidance upgrade

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