AES Semigas

Honeywell
27 February 2026

Infineon adds to CoolGaN Drive HB 600V G5 product family

Four new devices integrate two 600V GaN switches in half-bridge configuration with high- and low-side gate drivers and bootstrap diode

27 February 2026

UCSB’s James Buckwalter inducted as senior member of the US National Academy of Inventors

Honored for work on high-speed and high-frequency ICs integrating CMOS with III-Vs

27 February 2026

ROHM licenses TSMC’s GaN processs technology for Hamamatsu fab

End-to-end, in-house production from 2027 to meet demand for applications such as AI servers and EVs

26 February 2026
GaN-on-silicon HEMTs for millimeter-wave 5G
Devices at 30GHz reach more than 60% power-added efficiency with 1.1dB NFmin noise figure
25 February 2026

EPC adds 3-phase BLDC motor drive inverter evaluation board for humanoid robot joint applications

Integrated GaN power stage with onboard control, sensing and communication delivers up to 20ARMS in a 32mm circular design

18 February 2026

SemiQ debuting SiC power solutions for AI data centers and high-power infrastructure at APEC

QSiC Gen3 line featuring 1200V SOT-227, S3 half-bridge, B2T1 six-pack, and B3 full-bridge packages on display

17 February 2026

Wolfspeed adds VP of sales for EMEA

Stefan Steyerl to develop and execute regional sales strategy, driving adoption of SiC across automotive, industrial and energy markets

16 February 2026

SemiQ partners with distributor NAC Semi across North America

NAC Semi provides demand creation services, including dedicated FAE support

Bruker
LayTec

Microelectronics UK

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