AES Semigas

Honeywell
15 June 2026

CGD and NXP collaborate to accelerate time to market

Firms to deliver complete power conversion solutions for automotive and data-center markets

15 June 2026

Wolfspeed appoints Daniel Whalen as VP of investor relations

Recruit from Qorvo to enhance engagement with financial community

15 June 2026

China’s Supreme Court upholds injunction against Infineon, says Innoscience

Infineon prohibited from selling GaN products in mainland China

12 June 2026

Guerrilla RF launches flagship linear PA module for 4.4–5.2GHz band

35+dBm output power, 50%+ efficiency and fully integrated 50Ω input and output matching combined in a compact surface-mount package

11 June 2026

Imec adds high-density MIMCAPs, passive modeling and laser-assisted bonding to 300mm RF silicon interposer platform

System-level platform for heterogeneous integration of III V chiplets on Si CMOS targets mmWave/sub THz wireless and high speed data-center applications

11 June 2026

Northrop Grumman develops market-ready GaN chip for W-band RF in under six months

Project supported by Microelectronics Commons California DREAMS hub

10 June 2026

EPC launches smallest GaN drive based on EPC33110 for robots and drones

23mm GaN inverter achieves 11ARMS continuous current at 48V and 100kHz PWM

10 June 2026

EPC2378 25V, 410µΩ eGaN enters mass production for high-density DC–DC conversion

Combining ultra-low RDS(on) and fast switching for compact power designs

Bruker
LayTec

Microelectronics UK

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