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EPC releases compact, high-efficiency 180W GaN buck converter evaluation board for USB PD applications
No heatsink needed, suiting USB PD, laptops, and portable power applications.
UMass Lowell assistant professor Anhar Bhuiyan receives Ralph E. Powe Junior Faculty Enhancement Award
Early-career support to aid grant applications for gallium oxide device research
ROHM’s SiC MOSFET adopted for mass production in Toyota’s new BEV for Chinese market
Power module shipping from HAIMOSIC JV with Zhenghai Group
Renesas expects $1.7bn loss in first-half 2025 from Wolfspeed restructuring
Renesas’ $2.062bn deposit to be converted into convertible notes, common stock and warrants
Wolfspeed’s restructuring deal with lenders to reduce debt by 70% and interest payments by 60%
Restructuring to be completed by end of Q3, while operations to be fully funded through cash flow generation
Tagore launches compact, high-power RF receiver front-end module
TSL8028N tailored for 2–5GHz wireless infrastructure and radar applications 5G TDD infrastructure applications
Applied Materials and CEA-Leti expand joint lab to drive innovation in specialty chips
Collaboration focuses on materials engineering solutions to enable more energy-efficient AI data centers
UGREEN adds first 500W GaN charger to Nexode series
Six integrated GaN chips achieve 95% energy conversion rate
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