AES Semigas

27 February 2024

DOE launches $2.25m American-Made Silicon Carbide Packaging Prize

Contest aims to enable power modules to work more effectively at high voltage

27 February 2024

Finwave showcases performance improvements with GaN-on-Si technology at MWC Barcelona

3DGaN FinFETs enable higher power, speed and linearity for 5G/6G networks

26 February 2024

Arrow and Infineon collaborate to help eInfochips accelerate EV charger development

30kW DC fast charger reference platform includes 1200V CoolSiC Easy power modules

22 February 2024

Transphorm quarterly product revenue falls by 11% due to short-term demand pushouts

…but design-ins continue to rise, by 20%

21 February 2024

Navitas powers Samsung Galaxy S24 with integrated AI

GaNFast technology enables Super-Fast Charging

21 February 2024

TI launches new power conversion device portfolios at APEC

100V GaN power stages with thermally enhanced package technology shrink solution size by 40% and increase power efficiency while halving switching losses

20 February 2024

GlobalFoundries gains $1.5bn in CHIPS and Science Act funding

Projects to expand New York fab, build new fab, and upgrade Vermont fab for high-volume GaN manufacturing

20 February 2024

EPC highlighting power electronics solutions at APEC

Latest generation of GaN FETs and ICs showcased in variety of real-world applications.


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