AES Semigas

Sign Up to Our Free Weekly E-Brief

Microelectronics

LEDsMarketsMicroOptoPVSuppliers

Honeywell
15 December 2025

CEA-Leti and ST demo path to fully monolithic silicon RF front-ends with 3D sequential integration

Wafer-level assembly of SiGe HBT, RF SOI and passive technologies allows dense co-integration of best-in class functions

15 December 2025

Imec presents record WSe2-based 2D-pFETs for extending logic technology roadmap

Collaboration with TSMC yields Imax up to 690µA/µm; partnership with Intel yields improved fab-compatible modules for source/drain contact formation and gate stack integration, with reduced EOT

15 December 2025

NTT reports first RF operation of AlGaN transistors with Al-content over 0.75

Expanding applications of AlN from power conversion to post-5G wireless communications

15 December 2025

CHIPX to establish 8-inch GaN-on-SiC wafer fab in Malaysia

Front-end manufacturing to span infrastructure, R&D, engineering, talent development, and technology transfer

12 December 2025

Navitas expands global distribution network with Avnet

Building on existing Avnet Silica (Europe) relationship to support high-growth high-power markets

11 December 2025

Wise Integration, Powernet and KEC sign MoU to co-develop SMPS solutions for AI server power supplies in Korea

Powernet to lead development of new SMPS designs using Wise’s WiseGan and WiseWare technologies; KEC to manage back-end manufacturing

11 December 2025

Cornell develops HEMTs on single-crystal AlN substrate for RF power amplifiers

Usage of gallium reduced by several orders of magnitude

11 December 2025

SemiQ launches Gen3 1200V S3 modules for high-power industrial and EV applications

Family includes 608A half-bridge module with 2.4mΩ RDSon and best-in-class thermal resistance

Bruker
LayTec

Microelectronics UK

Book This Space

Follow us
on X (Twitter)

Join our LinkedIn network