AES Semigas

Honeywell
24 June 2025

EPC releases compact, high-efficiency 180W GaN buck converter evaluation board for USB PD applications

No heatsink needed, suiting USB PD, laptops, and portable power applications.

23 June 2025

UMass Lowell assistant professor Anhar Bhuiyan receives Ralph E. Powe Junior Faculty Enhancement Award

Early-career support to aid grant applications for gallium oxide device research

23 June 2025

ROHM’s SiC MOSFET adopted for mass production in Toyota’s new BEV for Chinese market

Power module shipping from HAIMOSIC JV with Zhenghai Group

23 June 2025

Renesas expects $1.7bn loss in first-half 2025 from Wolfspeed restructuring

Renesas’ $2.062bn deposit to be converted into convertible notes, common stock and warrants

23 June 2025

Wolfspeed’s restructuring deal with lenders to reduce debt by 70% and interest payments by 60%

Restructuring to be completed by end of Q3, while operations to be fully funded through cash flow generation

23 June 2025

Tagore launches compact, high-power RF receiver front-end module

TSL8028N tailored for 2–5GHz wireless infrastructure and radar applications 5G TDD infrastructure applications

19 June 2025

Applied Materials and CEA-Leti expand joint lab to drive innovation in specialty chips

Collaboration focuses on materials engineering solutions to enable more energy-efficient AI data centers

19 June 2025

UGREEN adds first 500W GaN charger to Nexode series

Six integrated GaN chips achieve 95% energy conversion rate

Bruker
LayTec

Microelectronics UK

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