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Honeywell
12 May 2026

Arizona State University, Rensselaer Polytechnic Institute and Stanford University to join Applied Materials’ EPIC Center in Silicon Valley

Research partnerships with to accelerate US lab-to-fab innovation by combining academic insights with commercial equipment and process expertise

12 May 2026

Applied Materials and TSMC partner at EPIC Center in Silicon Vallley to accelerate AI scaling

Firms to co-develop materials, equipment and process technologies to scale next-gen semiconductor devices

11 May 2026

Cyient launches India’s first GaN power IC family leveraging Navitas technology

First products for applications up to 650V to begin sampling by June

11 May 2026

Micro-LED CPO optical transceiver market to reach $848m by 2030

Shipments to begin scaling significantly in second-half 2028

11 May 2026

Wolfspeed’s quarterly margins and cash burn improved despite falling revenue

Growth in AI data centers and I&E applications to offset softness in EVs

7 May 2026

Canadian Photonics Fabrication Centre being spun off as commercial pure-play III-V foundry

CPFC fully transitioning to 4-inch wafers while it constructs new 8000ft2 building

6 May 2026

Xanadu and EVG partner on heterogeneous integration and wafer bonding processes for photonic quantum systems

EVG’s bonding expertise aiding Xanadu to engineer high-precision and ultra-clean interfaces

6 May 2026

Veeco receives $250m+ in equipment orders for manufacturing InP lasers

Multiple customers place high-volume orders for Spector, Lumina and wet processing systems

5 May 2026

UK Semiconductor Centre appoints first CEO

Andy McLean returns from USA to help accelerate scale-up, drive inward investment, and develop workforce

5 May 2026

AXT’s revenue grows 17% in Q1 after greater-than-expected export permits

InP wafer order backlog exceeds $100m, as new facility planned to double capacity again in 2027

4 May 2026

Aixtron’s Q1 revenue down 47% year-on-year, but opto drives 30% growth in orders

Operating cash flow boosted by reduction in working capital

1 May 2026

EU-funded HiPower 5.0 project developing GaN-based EV on-board chargers

Fraunhofer IZM using Infineon’s bi-directional GaN switches

Bruker
CS Clean
Vistec
Honeywell On-demand Webcast
News Features
17 April 2026
Silicon aluminium nitride on GaN MISHEMTs for 6G and X-band
Fujitsu device achieves 74.3% power-added efficiency and 10.4W/mm Pout.
17 April 2026
Nano-ridge surface-emitting lasers on 300mm silicon
First demonstration uses one-dimensional photonic crystal concept.
26 March 2026
Single- and multi-channel AlScN barriers
GaN channel heterostructures achieve a record 45Ω/□ sheet resistance.
26 March 2026
Micro-disk and micro-ring blue laser diodes
Continuous wave electrically pumped devices achieve Q factors up to 17,066, a claimed record.
9 March 2026
Induced fit Ga- semiconductor growth
Technique could enable optoelectronics on various rigid and flexible substrates.
26 February 2026
GaN-on-silicon HEMTs for millimeter-wave 5G
Devices at 30GHz reach more than 60% power-added efficiency with 1.1dB NFmin noise figure
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Feature Downloads
1 May 2026

Single- and multi-channel AlScN barriers
GaN channel heterostructures achieve a record 45Ω/□ sheet resistance.

1 May 2026

Silicon aluminium nitride on GaN MISHEMTs for 6G and X-band
Fujitsu device achieves 74.3% power-added efficiency and 10.4W/mm Pout.

1 May 2026

Power electronics market to grow at 10% CAGR to over $65bn by 2036
Wide-bandgap semiconductors are supporting higher-voltage operation and new power architectures across data centers, EVs and renewables, notes IDTechEx.

1 May 2026

Red InGaN micro-LEDs with narrow FWHM and high EQE
Researchers use a photonic crystal structure to achieve 5nm linewidth and 12% external quantum efficiency.

1 May 2026

Micro-LED transfer via electrochemical etch
UCSB researchers transfer arrays of devices down to 3μm onto silicon.

1 May 2026

Nano-ridge surface-emitting lasers on 300mm silicon
First demonstration uses one-dimensional photonic crystal concept.

31 March 2026

ALP-4-SiC project focusing on atomic layer processing for silicon carbide-based quantum photonic circuits
Max Planck Institute is designing and characterizing photonic components while Fraunhofer IISB contributes SiC technology.

31 March 2026

Compound semiconductor materials market growing at 14% CAGR to almost $5.2bn by 2031
Yole highlights a sustained structural growth phase as compound semiconductor materials are becoming core to power electronics, photonics and AI infrastructure.

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