Honeywell
11 September 2025

Wolfspeed announces commercial launch of 200mm silicon carbide wafers

Extension follows positive response to initial offering to select customers

10 September 2025

UMass Lowell’s Anhar Bhuiyan wins two US NSF grants worth $797,000 for gallium oxide research

$200,000 to research producing thicker films and diodes; $597,000 to test devices under extreme conditions

9 September 2025

Ayar Labs and Alchip to scale AI infrastructure with co-packaged optics

Collaboration to equip hyperscalers with scalable, power-efficient optical engines for next-gen AI workloads

9 September 2025

Axcelis launches Purion Power Series+ ion implant platform for SiC power devices

H200+, M+ and XE+ and EXE+ variants target high-energy high-current, medium-energy, and medium-current applications

9 September 2025

Infineon signs memorandum of understanding with China’s Lingji

Inverters for light electric vehicles to be based on CoolGaN G5 power transistors

9 September 2025

Scintil raises $58m to scale integrated photonics for AI factories

Series B funding round led by Yotta Capital enables expansion of photonic integration technology

9 September 2025

Wolfspeed’s reorganization plan approved by court

Firm expects to emerge from Chapter 11 process within several weeks

8 September 2025

CSA Catapult appoints Rupert Baines to board as non-executive director

Tech entrepreneur to support corporate governance and inform long-term strategy

8 September 2025

IQE expanding strategic review to potential sale of company

Full-year 2025 revenue of £90–100m to be down almost 20% on 2024

5 September 2025

CSA Catapult appoints Caroline O’Brien as CEO

Kubos’ CEO joins as interim CEO Raj Gawera reverts to non-executive director

4 September 2025
Laser transfer of blue micro-LED arrays
Rubber tape used as device carrier before thermo-compression bonding.
4 September 2025

VisIC unveils Gen 2 D3GaN 650V power devices

Efficiency increased by reducing RDS(ON) from Gen 1’s 22–8mΩ through Gen 1+’s 6mΩ to Gen 2’s 4mΩ

Bruker
CS Clean
Vistec
News Features
28 August 2025
E-mode GaN HEMT breakdown beyond 10kV
Optimized RESURF structure enables improved breakdown voltage–on-resistance trade-off.
21 August 2025
Foundry fabricated AlN-buffer HEMTs
Significant step towards industrial AlN/GaN/AlN transistors
20 August 2025
D-band GaN power HEMTs on silicon
Researchers report highest-frequency device performance so far.
12 August 2025
1200V fully vertical GaN-on-silicon MOSFETs
Fluorine-ion implant termination enables high breakdown.
7 August 2025
N-polar deep recess E-mode GaN HEMTs
Researchers achieve record-breaking frequency performance at 75nm gate length.
24 July 2025
Gallium oxide HFET combines polytypes
First ε-/α-Ga2O3 transistor achieves promising breakdown and on-resistance performance.
Feature Downloads
1 September 2025

Gallium oxide HFET combines polytypes
First ε-/α-Ga2O3 transistor achieves promising breakdown and on-resistance performance.

1 September 2025

Improving mobility in InAs quantum wells on GaAs substrate
Surface smoothing to reduce step bunching could enable less expensive, superior alternative for quantum information and other applications.

1 September 2025

ScAlN ferroelectric AlGaN HEMT opportunities
Potential for future reconfigurable multi-function, memory, and high-temperature applications.

1 September 2025

N-polar deep recess E-mode GaN HEMTs
Researchers achieve record-breaking frequency performance at 75nm gate length.

1 September 2025

Strain-relaxed bulk InGaN enables wavelength-stable red LEDs
Blue-shift in wavelength constrained to 6.2nm between 1mA and 100mA injection current.

28 July 2025

Mass production QF-HVPE of GaN-on-GaN system
Researchers claim record mobilities of 1591cm2/V-s and 18,175cm2/V-s at room temperature (295K) and low temperature (35K), respectively.

28 July 2025

Monolithic HEMT– micro-LED integration
Researchers reduce on-resistance by using a simplified fabrication process.

28 July 2025

Tracking down sources of efficiency droop
Researchers at UIUC have modified the ABC model to extract the impacts of Auger–Meitner recombination, charge polarization, and junction temperature.