21 September 2017

GlobalFoundries launches 8SW RF SOI process for next-gen mobile and 5G applications

300mm SOI technology enables cost-effective, high-performance RF front-end modules for 4G LTE mobile and sub-6GHz 5G applications

20 September 2017

HKUST/UCSB team demonstrates record 1.3μm CW submilliamp-threshold quantum dot micro-lasers on silicon

Electrically pumped QD lasers follow team’s prior development of CW optically pumped micro-lasers

19 September 2017

glō orders Aixtron G5+ 8x150mm MOCVD system for micro-LED production

Sweden’s Lund University spin-off targets products from Californian plant in 2018

19 September 2017

QSFP-DD MSA Group releases 3.0 Hardware specification

Quad Small Form Factor Pluggable Double Density pluggable transceiver module spec updated

18 September 2017

CWDM8 MSA Group formed to support deployment of 400G 2km and 10km optical links in data centers

Industry consortium defining and promoting cost-effective, extended-reach 400G optical specs addressing intra- and inter-data-center applications

18 September 2017

4WDM MSA for 100G optical networks extended from 10km with specs for 20km and 40km reach

Market for 20 & 40km reach to rise to $300m by 2020, as 10km surpasses $1bn in 2017

18 September 2017

SFP-DD MSA releases spec for high-speed, high-density interface

The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group has completed the initial hardware specification and drawings for the SFP-DD pluggable interface designed to enable high-speed, high-density networking equipment.

18 September 2017

Ascatron launches its first SiC power device products

Swedish spin-off extends from epi supply to semi-fabless device producer

15 September 2017

DOE achieves SunShot’s 2020 utility-scale solar cost target of $0.06/kWh

$82m early-stage funding announced for CSP and power electronics as part of new 2030 focus on reliability, resilience and storage

14 September 2017

SDK expanding high-grade SiC epi production capacity from 3000 to 5000 wafers per month

Expanded facilities to begin operation in April 2018

14 September 2017

IQE extends production of VCSEL epiwafers with Aixtron AIX 2800G4-TM MOCVD systems

8x6” reactors to be installed in newly leased South Wales plant

14 September 2017

NCSU rolls out PRESiCE manufacturing process to open up SiC power device market to more companies

PowerAmerica-supported development qualified at X-Fab foundry

13 September 2017

Thinning p-type III-nitride layers to enhance effects of surface plasmons

13 September 2017

Norstel completes 150mm SiC n-type wafer development

Customer samples to be available by first-quarter 2018

13 September 2017

100G Lambda MSA to define specification for next-generation optical links

22 founding members collaborate to accelerate specification of 100Gbps per wavelength optical interfaces

13 September 2017

Evatec expanding Greater China operations to support rapid business growth

Thin-film equipment firm setting up own independent sales & service organizations in both Taiwan and China

12 September 2017

InnovateUK awards £1.1m to SUPER8 project to develop 200G 8-channel CWDM transceiver for hyper-scale cloud data-centers

CSC, Kaiam and CST to deliver commercial-grade solution for high-volume manufacturing within 30 months

12 September 2017

BluGlass’ upgraded BLG-300 chamber demonstrates targeted thickness uniformity for LED wafers up to 6”

LED efficiency demonstrated on par with prior RPCVD results, with significantly improved performance uniformity

12 September 2017

AXT completes purchase of new manufacturing facility in Dingxing, China

Staged relocation of GaAs manufacturing from Beijing begins

12 September 2017

JEDEC forms committee to set standards for wide-bandgap power semiconductors

JC-70 Wide Bandgap Power Electronic Conversion Semiconductors committee seeks participants

11 September 2017

Finisar’s quarterly revenue falls 4.4%, as lower 10G transceiver demand offsets growth in 100G QSFP28 transceivers

High-power VCSEL array production ramp delayed a quarter by change in manufacturing process