AES Semigas

Honeywell
28 April 2026

onsemi and Geely expand collaboration to support next-gen 900V EV architectures

EliteSiC power technologies integrated into Super Electric Power System

28 April 2026

Beijing Intellectual Property Court upholds validity of Innoscience’s GaN patents

Infineon’s invalidation requests rejected

27 April 2026

onsemi and NIO expand collaboration to accelerate transition to next-gen 900V EV platforms

EliteSiC enhanced M3e technology enables faster charging, longer range and stronger performance

22 April 2026

Wolfspeed appoints Tokyo-based regional president for Asia Pacific

Yasuhisa Harita to lead commercial strategy across Japan, Korea and ASEAN

22 April 2026

Bosch sampling third-generation SiC chips to global automakers

Smaller size and 20% higher performance increase drive electronics efficiency

22 April 2026

TU Delft’s Karen Dowling receives NWO Open Competition ENW-XS grant

Investigating thermoelectric properties of GaN for space exploration at extreme temperatures

21 April 2026

Quinas advances ULTRARAM development with atomic-scale processing at KAUST Core Labs

OIPT’s ALE technology used to fabricate quantum-engineered device structures

21 April 2026

ROHM develops 5th generation SiC MOSFETs

ON-resistance reduced by 30% at high temperature versus 4th Gen

Bruker
LayTec

Microelectronics UK

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