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onsemi and Geely expand collaboration to support next-gen 900V EV architectures
EliteSiC power technologies integrated into Super Electric Power System
Beijing Intellectual Property Court upholds validity of Innoscience’s GaN patents
Infineon’s invalidation requests rejected
onsemi and NIO expand collaboration to accelerate transition to next-gen 900V EV platforms
EliteSiC enhanced M3e technology enables faster charging, longer range and stronger performance
Wolfspeed appoints Tokyo-based regional president for Asia Pacific
Yasuhisa Harita to lead commercial strategy across Japan, Korea and ASEAN
Bosch sampling third-generation SiC chips to global automakers
Smaller size and 20% higher performance increase drive electronics efficiency
TU Delft’s Karen Dowling receives NWO Open Competition ENW-XS grant
Investigating thermoelectric properties of GaN for space exploration at extreme temperatures
Quinas advances ULTRARAM development with atomic-scale processing at KAUST Core Labs
OIPT’s ALE technology used to fabricate quantum-engineered device structures
ROHM develops 5th generation SiC MOSFETs
ON-resistance reduced by 30% at high temperature versus 4th Gen
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