Sign Up to Our Free Weekly E-Brief
LEDsMarketsMicroOptoPVSuppliers
QuInAs links device physics to AI system performance using ULTRARAM
Work presented at International Symposium on Quality Electronic Design
HRL’s T3L 40nm GaN-on-SiC technology achieves Manufacturing Readiness Level 6
Process is compatible with three-dimensional heterogeneous integration architectures
IVWorks raises $4.5m to expand reGaN technology into RF and AI power semi markets
Targeting E/W-band RF in satcoms and wireless backhaul, and expanding into AI power delivery through PoL converters for HBM and GPU platforms
EPC launches 100V integrated GaN power stage ICs for motor drives with improved control and protection
ePower Stage ICs provide fast shutdown in fault condition, support continuous 100% duty-cycle operation, and have single-input-pin PWM option to ease multi-axis designs
onsemi’s hybrid power integrated modules used in Sineng Electric’s solar and energy storage solutions
F5BP PIMs integrate FS7 IGBT and EliteSiC diode technologies
EPC Space adds EPC7C010 and EPC7C011 half-bridge buck platforms for high-rel and rad-hard applications
High efficiency and flexibility support next-gen aerospace and industrial systems with adjustable switching frequencies
MoU signed to discuss integrating Toshiba Electronic Devices & Storage’s semiconductor business, ROHM’s semiconductor business, and Mitsubishi Electric’s power device business
Toshiba–ROHM power device discussions now joined by Mitsubishi Electric
Wolfspeed reduces senior secured note balance by 43% after raising $475.9m in private placements
Refinancing to cut annual interest expense by $62m and total debt by $97m
Follow us on X (Twitter)
Join our LinkedIn network