AES Semigas

Honeywell
5 December 2025

onsemi releases EliteSiC MOSFETs in T2PAK top-cool package

Enhanced thermal performance, reliability and design flexibility for automotive and industrial applications

5 December 2025

X-FAB’s XbloX accelerates time-to-market for scalable, high-performance SiC MOSFETs

Improved on-state resistance enables 30% area reduction

4 December 2025

ROHM launches 13–65mΩ SiC MOSFETs in TOLL package

About 39% improved thermal performance enables high-power handling despite 26% smaller footprint and low 2.3mm profile

4 December 2025

Infineon enhances Electreon’s wireless in-road EV charging with silicon carbide technology

Customized SiC modules maximize power density, enabling EV to operate 24 hours a day with smaller batteries

4 December 2025

Filtronic awarded £1.2m funding to develop 550W Ka-band solid-state power amplifiers

UK Space Agency’s National Space Innovation Programme targets replacement of TWTAs

3 December 2025

Vishay launches 1200V SiC MOSFET power modules in MAACPAK PressFit package

38mΩ and 75mΩ VS-MPY038P120 and VS-MPX075P120 combine silicon carbide with rugged transfer mold construction

3 December 2025

US ITC preliminary determination finds violation of Infineon patent by Innoscience

Final determination could lead to import ban of products into USA

3 December 2025

onsemi and Innoscience sign MoU to collaborate on speeding global rollout of GaN power portfolio

onsemi’s system integration, drivers and packaging to combine with Innoscience’s GaN wafers and high-volume manufacturing

Bruker
LayTec

Microelectronics UK

Book This Space