AES Semigas

Honeywell
22 April 2026

Wolfspeed appoints Tokyo-based regional president for Asia Pacific

Yasuhisa Harita to lead commercial strategy across Japan, Korea and ASEAN

22 April 2026

Bosch sampling third-generation SiC chips to global automakers

Smaller size and 20% higher performance increase drive electronics efficiency

22 April 2026

TU Delft’s Karen Dowling receives NWO Open Competition ENW-XS grant

Investigating thermoelectric properties of GaN for space exploration at extreme temperatures

21 April 2026

Quinas advances ULTRARAM development with atomic-scale processing at KAUST Core Labs

OIPT’s ALE technology used to fabricate quantum-engineered device structures

21 April 2026

ROHM develops 5th generation SiC MOSFETs

ON-resistance reduced by 30% at high temperature versus 4th Gen

17 April 2026
Silicon aluminium nitride on GaN MISHEMTs for 6G and X-band
Fujitsu device achieves 74.3% power-added efficiency and 10.4W/mm Pout.
17 April 2026

Infineon’s rad-hard devices used aboard NASA’s Artemis II Orion capsule

JANS-qualified device is first internally manufactured rad-hard GaN transistor on market

16 April 2026

Quinas completes Innovate UK project advancing ULTRARAM for AI and neuromorphic computing

Project supports work toward ULTRARAM crossbar arrays and future chiplet-level integration

Bruker
LayTec

Microelectronics UK

Book This Space