Honeywell
19 September 2025

Honda Prize awarded to surface-emitting laser pioneer Dr Kenichi Iga

Honor for the conception and development of the VCSEL, and its practical application

19 September 2025

Northrop Grumman opens up Microelectronics Center access to external aerospace & defense firms

Business model strengthens US manufacturing infrastructure and assures microelectronics supply chain

18 September 2025

POEM Technology Center inaugurated at University of Copenhagen’s Niels Bohr Building

Denmark gains its first 300mm-wafer chip production facility

17 September 2025

La Luce Cristallina launches 200mm barium titanate substrate

New fab to scale up wafer production to support telecom and data-center demands

17 September 2025

University of Glasgow reports single-chip laser system with 983Hz linewidth

Topological interface state extended laser with optical injection locking integrated on InP substrate

17 September 2025

Cardiff University report highlights urgent need to strengthen semiconductor skills in Wales

CSconnected Strength in Places Fund program focuses on long-term investment in STEM and vocational pathways

15 September 2025

Micro-LED chip market to surpass $461m by 2029, driven by adoption in smartwatches

Commercialization in TVs, smartwatches and automotive displays to be joined by near-eye displays

15 September 2025

Smartphone production rises 4% in Q2 to 300 million units

Brands such as Oppo and Transsion recover after inventory adjustments

15 September 2025

Wolfspeed’s quarterly revenue rebounds by 6%, led by 10% growth in Power Products

Full-year revenue falls by 6% as Materials Products shrink by 12.3%

15 September 2025

Photon Design adds application engineers to support growth and expedite new product introductions

Laser and PIC simulation team expanding to serve research using PICWave and HAROLD

12 September 2025

NREL’s silicon carbide-based ULIS power module claims record efficiency, power density, and low-cost manufacturability

Ultra-Low Inductance Smart power module adaptable to gallium nitride and gallium oxide

11 September 2025
Boron nitride as a buffer and gate dielectric
GaN HEMTs demonstrate ultra-high ~1011 on/off current ratio.
Bruker
CS Clean
Vistec
News Features
4 September 2025
Laser transfer of blue micro-LED arrays
Rubber tape used as device carrier before thermo-compression bonding.
28 August 2025
E-mode GaN HEMT breakdown beyond 10kV
Optimized RESURF structure enables improved breakdown voltage–on-resistance trade-off.
21 August 2025
Foundry fabricated AlN-buffer HEMTs
Significant step towards industrial AlN/GaN/AlN transistors
20 August 2025
D-band GaN power HEMTs on silicon
Researchers report highest-frequency device performance so far.
12 August 2025
1200V fully vertical GaN-on-silicon MOSFETs
Fluorine-ion implant termination enables high breakdown.
7 August 2025
N-polar deep recess E-mode GaN HEMTs
Researchers achieve record-breaking frequency performance at 75nm gate length.
Feature Downloads
1 September 2025

Gallium oxide HFET combines polytypes
First ε-/α-Ga2O3 transistor achieves promising breakdown and on-resistance performance.

1 September 2025

Improving mobility in InAs quantum wells on GaAs substrate
Surface smoothing to reduce step bunching could enable less expensive, superior alternative for quantum information and other applications.

1 September 2025

ScAlN ferroelectric AlGaN HEMT opportunities
Potential for future reconfigurable multi-function, memory, and high-temperature applications.

1 September 2025

N-polar deep recess E-mode GaN HEMTs
Researchers achieve record-breaking frequency performance at 75nm gate length.

1 September 2025

Strain-relaxed bulk InGaN enables wavelength-stable red LEDs
Blue-shift in wavelength constrained to 6.2nm between 1mA and 100mA injection current.

28 July 2025

Mass production QF-HVPE of GaN-on-GaN system
Researchers claim record mobilities of 1591cm2/V-s and 18,175cm2/V-s at room temperature (295K) and low temperature (35K), respectively.

28 July 2025

Monolithic HEMT– micro-LED integration
Researchers reduce on-resistance by using a simplified fabrication process.

28 July 2025

Tracking down sources of efficiency droop
Researchers at UIUC have modified the ABC model to extract the impacts of Auger–Meitner recombination, charge polarization, and junction temperature.