News: Microelectronics
26 June 2026
Infineon launches EasyPACK S module and packaging concept
The demand for higher power densities in increasingly space-constrained environments continues to grow, whether in on-board chargers for electric vehicles or power supplies for AI data centers. At the recent PCIM Europe 2026 (Power Electronics, Intelligent Motion, Renewable Energy and Energy Management) Expo & Conference in Nuremberg, Germany (9–11 June), Munich-based Infineon Technologies AG hence introduced EasyPACK S, a compact power module and packaging concept specifically designed to meet these requirements. With a package height of only 5.6mm and a footprint of about 33mm x 36mm, EasyPACK S is said to enable significant system miniaturization while ensuring reliable thermal performance and reduced electromagnetic interference. The first modules available in the new package integrate Infineon’s CoolSiC MOSFETs 1200V G2 as well as IGBT4 and IGBT7 1200V technology.
Picture: Infineon’s EasyPACK S module and packaging concept enables compact designs for high-power-density applications.
EasyPACK S is qualified according to the latest industrial and automotive standards. Leveraging Infineon’s .XT interconnection technology, the modules offer enhanced reliability and long lifetime. An integrated direct bonded copper substrate ensures stable thermal performance and uniform temperature distribution. By using a new plastic material and silicone gel, the modules support continuous operating temperatures of up to Tvj(op) = 175°C. PressFIT pins double the current-carrying capacity and simplify PCB mounting. The mechanical design enables automated production processes through defined gripping areas, alignment holes and reduced pin-to-pin tolerance, helping to reduce manufacturing time and cost.
Designed with future requirements in mind, EasyPACK S is suitable for next-generation silicon carbide (SiC) and gallium nitride (GaN) devices while meeting stringent lifetime and reliability targets. Its scalable platform architecture offers what is claimed to be exceptional design flexibility across semiconductor technologies, chip configurations, topologies and power classes, enabling optimized performance and accelerating design-in.
The first EasyPACK S modules featuring CoolSiC MOSFETs G2 and IGBT4 technology are available from July.
Infineon presenting at PCIM Europe 2026
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