News: Microelectronics
26 May 2026
Infineon presenting at PCIM Europe 2026
In booth 470 (hall 7) at the PCIM Europe 2026 (Power Electronics, Intelligent Motion, Renewable Energy and Energy Management) Expo & Conference in Nuremberg, Germany (9–11 May), Infineon Technologies AG of Munich, Germany is showcasing its semiconductor portfolio for future-proof power infrastructure, AI data centers, robotics and electro-mobility.
Specifically, the firm is presenting a range of power system solutions spanning silicon (Si), silicon carbide (SiC) and gallium nitride (GaN) semiconductors, complemented by software, tools and cybersecurity expertise.
Demonstrations at PCIM 2026 are as follows:
- Making power infrastructure future-proof: As renewable energy continues to scale, robust power infrastructure is essential to support energy-intensive applications like AI data centers and advanced factories. At PCIM, Infineon is demonstrating its semiconductor technologies for efficient battery storage systems, uninterruptible power supplies (UPS), solid-state transformers (SST) and solid-state circuit breakers (SSCB). Highlights include a demo stack for SSTs, as well as SSCB components based on CoolSiC JFET technology, enabling fault isolation within microseconds and delivering high robustness for future DC grids.
- Powering AI from grid to core: Rapidly rising AI computing workloads are driving a sharp increase in data-center energy demand and accelerating the shift toward new power architectures such as HVDC sidecars and DC microgrids. At PCIM, Infineon is presenting a comprehensive Si, SiC and GaN portfolio supporting this transformation from grid connection to processor core. Exhibits include power semiconductors, drivers, micro-controllers and sensors for advanced power supply units, as well as solutions for battery backup units, intermediate bus converters, voltage regulation and intelligent protection devices.
- Shaping the future of electro-mobility: Infineon says that it is advancing electro-mobility as the global market leader in automotive semiconductors. PCIM highlights linked to this area include solutions for traction inverters, DC–DC converters, on-board chargers and battery management systems. Visitors can explore the firm’s ‘One Inverter, One Infineon’ system solution, designed to improve drivetrain efficiency while optimizing space and cost. Additional demos showcase CoolSiC and CoolGaN power switches, the new EasyPACK S and CIPOS Prime module solutions, XENSIV sensors and AURIX TC4xx micro-controllers.
- Empowering robotics: Robots are rapidly evolving toward physical AI systems that can sense, think and act. At PCIM, Infineon is showcasing semiconductor solutions supporting this evolution across industrial and domestic robots, humanoids and drones. Demos include high‑efficiency motor control and power management solutions based on CoolGaN power semiconductors, PSOC Control C3 micro-controllers and XENSIV sensors, enabling compact designs, precise control and robust operation in future robotic applications.
- EU Cyber Resilience Act: Across all focus topics, Infineon is highlighting its commitment to security. At PCIM, experts are addressing upcoming regulatory requirements of the EU Cyber Resilience Act, illustrating how secured‑by‑design semiconductor solutions enable customers to meet compliance demands while strengthening product differentiation.
Infineon is also contributing to the PCIM conference program and the various expo stages.
