News: Microelectronics
29 October 2025
Infineon launches EasyPACK C package, with silicon carbide power module as first product
Infineon Technologies AG of Munich, Germany is launching EasyPACK C, the next generation of its EasyPACK package family, for industrial applications such as fast DC electric vehicle (EV) charging, megawatt charging, energy storage systems and uninterruptible power supplies (UPS) operating under harsh conditions and fluctuating load profiles, which demand high efficiency, robust power cycling capability and long lifetime.
Picture: The first product in Infineon’s new EasyPACK C package.
The first products in this new package are silicon carbide (SiC) power modules that integrate Infineon’s CoolSiC MOSFETs 1200V G2 and its proprietary .XT interconnection technology. By reducing static losses and improving reliability, the modules help to address increasing energy demand and sustainability goals in industrial applications.
Leveraging Infineon’s CoolSiC MOSFET G2 technology, the new products enable designs with more than 30% higher power density and up to 20 times longer lifetime compared to the previous generation of CoolSiC MOSFETs. In addition, they offer a significant reduction in RDS(on), with around 25% improvement. Furthermore, the new EasyPACK C housing concept enhances power density and layout flexibility, paving the way for future designs with higher voltage classes. Infineon’s proprietary .XT interconnection technology further extends device lifetime.
The modules withstand overload switching conditions up to Tvj(over) = 200°C. They include new PressFIT pins that double current capacity, reduce PCB-level temperatures, and improve the mounting process. A new plastic material and silicone gel support operating temperatures of up to Tvj(op) = 175°C. Furthermore, the modules offer an isolation rating of 3kV AC for 1 minute. These features contribute to what is claimed to be outstanding module and system efficiency, extended lifetime, and high temperature resilience.
The new modules in the EasyPACK C package are available in various topologies, including 3-level and H-bridge configurations, with options with and without thermal interface material.
The first modules featuring the CoolSiC MOSFET G2 technology in the EasyPACK C package are available now. Infineon plans to further expand the product portfolio to meet the evolving needs of diverse applications.
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