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27 May 2020

KLA launches Electronics, Packaging and Components Group

Process control and yield management solutions provider KLA-Tencor Corp of Milpitas, CA, USA has formed a new business group focused on growth in its Electronics, Packaging and Components (EPC) businesses. Led by executive VP Oreste Donzella and providing systems and services across the semiconductor and microelectronics value chain, the EPC group brings together the ICOS, Orbotech and SPTS Technologies organizations to target growth opportunities in new and expanding end markets.

“This new group integrates KLA’s acquisition of the Orbotech and SPTS business to bring complementary technologies, products and services into one organization to drive innovation and results in fast-growing markets,” says KLA’s president & CEO Rick Wallace. “By applying the KLA operating model, we will enable common processes that allow the new group to deliver superior value to our customers across the electronics value chain,” he adds. “This strategy is expected to accelerate profitability and growth in segments outside our core semiconductor process control markets, as outlined during our September 2019 investor day.”

Global megatrends such as 5G, artificial intelligence (AI) and the Internet of Things (IoT) continue to drive growth across key industries like mobile, data center, automotive and virtual connectivity, notes KLA. This momentum is leading to innovation across specialty semiconductor process, advanced packaging and printed circuit board (PCB) manufacturing to enable new capabilities in the key industries, while supporting increasing quality requirements in manufacturing, the firm adds. Advanced packaging technologies and high-density interconnects are employed in high-performance computing (HPC) to enable AI. Wafer processing capabilities for new substrate materials like silicon carbide (SiC) and gallium nitride (GaN) are accelerating the transition to electric vehicles (EVs). Novel packaging designs, including integrated antenna in RF devices, are key enablers for the advancement of 5G connectivity. Finally, MEMS and IoT sensors for healthcare, smart homes and smart factories will help to transform and improve lives over the coming years, KLA adds.

KLA reckons that this new business organization will allow it to be more focused on meeting the changing needs of customers and the marketplace during this growth phase.

The EPC group joins KLA’s existing business units, Semiconductor Process Control (which creates and deploys highly differentiated inspection and metrology products) and Global Support and Services (managing the firm’s recurring revenue subscription-based services group and KLA Pro legacy systems).

See related items:

KLA completes acquisition of SPTS’ parent firm Orbotech

Tags: KLA-Tencor SPTS

Visit: www.kla.com

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