News: Optoelectronics
18 September 2026
Tower highlighing high-volume silicon photonics and SiGe solutions at ECOC
Specialty analog foundry Tower Semiconductor Ltd of Migdal Haemek, Israel is participating in booth #C1014 at the European Conference on Optical Communications (ECOC 2026) exhibition at the Palacio de Ferias y Congresos de Málaga (FYCMA) in Spain (21–23 September), where company representatives are available for meetings to discuss current and future silicon photonics roadmap.
Tower is showcasing its high-volume and high-performance silicon photonics platform, which is widely utilized across the industry for data-center and telecom optical transceivers, as well as for high-growth applications, including near- and co-packaged optics (NPO/CPO) for next-generation AI cluster architectures, DWDM lasers, optical circuit switching, FMCW LiDAR for physical AI, and quantum computing.
The company is also featuring its silicon germanium (SiGe) BiCMOS solutions, which complement its SiPho platform to address the higher-bandwidth, lower-latency and lower-power demands of next-generation AI infrastructure.
Tower extends 300mm wafer bonding technology across SiPho and SiGe BiCMOS
