News: Microelectronics
12 March 2026
ROHM’s TRCDRIVE pack, HSDIP20 and DOT-247 silicon carbide molded power modules now available online
Japan-based ROHM has begun online sales of new TRCDRIVE pack, HSDIP20 and DOT-247 silicon carbide (SiC) molded modules, available from distributors including DigiKey and Farnell.
The TRCDRIVE pack is a 2-in-1 SiC molded module compatible with traction inverters for xEV (electric vehicles) up to 300kW. ROHM’s 4th-Generation SiC MOSFETs with low ON resistance are built in, resulting in what is claimed to be industry-leading power density 1.5 times higher than that of general SiC molded modules while contributing to the miniaturization of inverters for xEVs. Furthermore, its terminal layout allows easy connection by pushing the gate driver board from the top, reducing installation time. Applications include automotive equipment such as xEV traction inverters.
The HSDIP20 is a SiC module in 4-in-1 and 6-in-1 configurations, suitable for xEV onboard chargers (OBC), EV charging stations, server power supplies, AC servos, and similar applications. The lineup includes six models rated at 750V and seven rated at 1200V. All basic circuits required for power conversion in various high-power applications are integrated into a compact module package, reducing the design workload for manufacturers and enabling the miniaturization of power conversion circuits. Applications include automotive equipment (OBC, DC-DC converters, electric compressors) and industrial equipment (EV charging stations, V2X systems, AC servos, server power supplies, PV inverters, and power conditioners).
The DOT-247 is a 2-in-1 SiC module suitable for industrial applications such as PV inverters and UPS systems. The module retains the versatility of the widely adopted TO-247 package while achieving high power density. Furthermore, it supports various circuit configurations through two topologies: half-bridge and common-source. By adopting it in power conversion circuits that incorporate multiple discrete components, it reduces the number of components and mounting area, contributing to circuit miniaturization and reduced design effort. Applications include: automotive equipment such as ePTO (electric power take-off), boost converters for FCVs (fuel cell vehicles); and industrial equipment such as PV inverters, UPS (uninterruptible power supply), AI servers/data centers, EV charging stations, and semiconductor relays, eFuse).
ROHM launches DOT-247 2-in-1 SiC molded module
ROHM adds high-power-density 4-in-1 and 6-in-1 SiC power modules in HSDIP20 package
ROHM adds 2-in-1 silicon carbide molded modules to TRCDRIVE pack series
