News: Microelectronics
26 June 2026
Infineon sampling H-DPAK addition to top-side-cooling package family
With power conversion architectures in automotive and industrial applications evolving rapidly (placing new demands on switching topologies, thermal management, and system integration), Infineon Technologies AG of Munich, Germany has made available samples of the H-DPAK, a new addition to its top-side-cooling package family, housing integrated half-bridge (HB) devices in 750V CoolSiC G2 technology.
Picture: Infineon’s H-DPAK top-side-cooling package, housing integrated half-bridge devices in 750V CoolSiC G2 technology.
The 750V CoolSiC G2 is said to bring the reliability margin that modern grids and energy systems demand. The H-DPAK integrates a complete unidirectional half-bridge power stage in a single package. A split lead frame design with optimized drain pads enhances heat spreading and ensures clearance compliance in dense, high-power board layouts, while matching the industry-standard 2.3mm height of Infineon’s established Q-DPAK and TOLT packages for seamless board-level integration.
The result is a liquid-cooling-ready, scalable, drop-in-compatible solution that reduces parasitic loop inductance for cleaner fast switching, cuts passive component size, and delivers the proven performance of CoolSiC technology – including what is claimed to be excellent RDS(on) x QOSS, best-in-class RDS(on) x Qfr, and superior robustness under avalanche, overload, and short-circuit conditions.
The H-DPAK half-bridge is engineered as a core switching cell adaptable across a broad range of power conversion topologies. Its integrated architecture enables more compact applications where the space utilization and total cost of ownership are a priority. Operating at higher switching frequencies than discrete board-level solutions, the H-DPAK is said to deliver measurable improvements in dynamic performance, enabling more compact magnetic designs and higher overall system efficiency. Target applications span the full breadth of industrial and automotive power systems, including:
- next generation HVDC AI PSU (5L ANPC);
- HVDC battery and capacitor backup units;
- solid-state transformers;
- residential solar and energy storage;
- humanoid charging;
- two-stage and single-stage on-board chargers (OBCs);
- DC–DC converters;
- auxiliaries for electric vehicles (xEVs).
The 750V CoolSiC G2 delivers low Qg for reduced gate drive losses, high dv/dt capability for high-frequency operation, and wide gate-bias tolerance for greater design margin and compatibility with existing gate driver architectures, well suited for high-power industrial and automotive applications where robustness and switching efficiency are paramount.
The H-DPAK expands Infineon’s top-side-cooled family, enabling native liquid cooling in the most demanding and rapidly evolving applications.
Infineon adds new packages to CoolSiC MOSFET 750V G2 family
