News: Microelectronics
18 February 2026
SemiQ debuting SiC power solutions for AI data centers and high-power infrastructure at APEC
In booth #1451 at the IEEE Applied Power Electronics Conference (APEC 2026) at the Henry B Gonzalez Convention Center, San Antonio, TX, USA (22–26 March), SemiQ Inc of Lake Forest, CA, USA — which designs, develops and manufactures silicon carbide (SiC) power semiconductors and 150mm SiC epitaxial wafers for high-voltage applications — is debuting its latest SiC module advances.
The modules have been designed to deliver compact and efficient solutions for active front ends (AFE) and the high‑performance compressor units used in advanced data-center cooling systems.
The new lineup has been engineered to meet the rising power and thermal demands of AI-driven data centers, high-power industrial, and electric vehicles (EV) applications.
Product highlights
Visitors to the booth can see the SemiQ’s latest QSiC Gen3 SiC modules, which feature a 30% reduction in specific on-resistance (RONsp) and turn-off energy losses (EOFF) versus its previous generations. These modules significantly reduce cooling complexity and switching losses for EV charging stations, energy storage systems, and industrial motor drives.
Additional showcased advances include:
- S3 modules: this family includes a 608A half-bridge module with an ultra-low 2.4mΩ RDSon and a junction-to-case thermal resistance (RθJC) of just 0.07ºC/W;
- SOT-227 modules: featuring five modules with RDSon values of 7.4mΩ, 14.5mΩ and 34mΩ, optimized for server power supplies, battery chargers and PV inverters;
- B2T1 six-pack modules: spanning an RDSon range of 19.5–82mΩ designed to minimize parasitics in motor drives and advanced AC-DC converters;
- B3 full-bridge modules: delivering up to 120A with RDSon as low as 8.6mΩ, these modules maximize power density for high-voltage DC–DC systems.
“These SiC technologies directly address the challenges faced by those implementing AI infrastructure,” says president Dr Timothy Han. “By improving efficiency, and addressing the escalating power demands of data centers across key application areas, we are expanding the potential for AI to scale sustainably.”
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