News: Suppliers
24 November 2025
Beneq unveils Transmute high-throughput ALD tool for power, RF and μLED device production
Atomic layer deposition (ALD) equipment and solutions firm Beneq of Espoo, Finland has launched Transmute, a next-generation ALD platform designed for high-volume semiconductor manufacturing. Engineered for high volume production of wide-bandgap (WBG) power electronics, advanced RF devices, and micro-LEDs and other specialty devices, the new systemcombines performance, scalability and cost efficiency in one system.
Atomic precision at manufacturing speed
Transmute extends the performance of the Transform XP platform into production environments with Beneq’s proprietary 3-step ALD architecture. By combining plasma pre-treatment, plasma-enhanced ALD (PEALD) and thermal batch ALD, the platform delivers conformal, high-performance dielectric stacks with atomic-level interface control – now at high throughput.
Its flow-uniform 25-wafer chambers, paired with advanced precursor dosing technology, enable rapid cycle times, optimized wafer coverage, and reduced material waste – resulting in a low cost of ownership across a broad range of semiconductor applications.

Picture: Beneq Transmute ALD platform.
“Beneq Transmute represents a major leap forward in making ALD a truly high-volume manufacturing solution,” says Lucas Monteiro, head of product. “By combining the precision of ALD with throughput and scalability that match production demands, we are giving our customers the ability to produce next-generation wide-bandgap and RF devices at high throughput and low cost of ownership – with the uncompromised film quality that Beneq is known for.”
Designed for dedicated production requirements
Transmute supports both thermal and plasma-enhanced ALD within a modular cluster architecture that enables dedicated configurations. With up to two transfer chambers and eleven process module slots – including PEALD, Thermal, Buffer, and Preheater – each system can be tailored to match specific customer applications and fab roadmaps while ensuring long-term scalability.
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