News: Microelectronics
22 May 2026
EPC showcasing GaN power solutions at PCIM
On stand 304 (Hall 9) at the Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM 2026) Expo & Conference in Nuremberg, Germany (9–11 June), Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — is showcasing its newest-generation GaN technology for humanoid robotics, drones and compact electrified motion systems.
EPC is demonstrating how its Gen 7 GaN platform enables compact, production-ready power architectures for next-generation intelligent motion systems and AI power delivery. These devices offer higher switching frequency, lower losses and tighter layouts — improving efficiency and integration in robotic motion control.
The motion platforms are powered by EPC’s latest GaN power devices including the EPC33110 integrated three-phase ePower Stage IC for compact humanoid joint and drone propulsion control. The EPC23108/09 and EPC23110/11 integrated ePower Stage IC families support operation up to 100V, with load current capability of 35A (EPC23108, EPC23109) and 20A (EPC23110, EPC23111), enabling reliable high-frequency switching performance.
In the power conversion stage, EPC is also highlighting the EPC2366 40V eGaN FET with ultra-low 0.84mΩ RDS(on) specifically designed for synchronous rectifier applications on the secondary side of a 48V–12V LLC converter; and the EPC2361, 100V with typical RDS(on) of 0.75mΩ. EPC2304 (200V, 3.5mΩ), EPC2305 (150V, 2.2mΩ) for high-power isolated DC–DC conversion, and the EPC2057 (50V, 6mΩ) for compact intermediate-bus regulation.
EPC is also highlighting the latest Gen 7 products: EPC2370 (15V, 0.28mΩ), EPC2378 (25V, 0.35mΩ), and EPC2377 (40V, 0.5mΩ) in compact 3.3mm x 3.3mm dual-cool QFN packages, along with the EPC2375 (100V, 0.9mΩ) in a 3mm x 5mm dual-cool QFN. These devices deliver benchmark RDS(on) and low gate charge for high-efficiency, high-power-density modules and DC–DC power supplies used in AI data centers, robotics, and advanced motor drive applications.
These devices are demonstrated on different platforms, shown at PCIM Europe, for development of humanoid robotics and drone propulsion. The EPC91122 and EPC91132 are motor-drive reference designs based on the EPC33110. The EPC91122 is being demonstrated in both a large drone propulsion system and a robotic arm platform to demonstrate suitability for high-torque, high-power-density motion architectures. A small drone propulsion system designed for lightweight, space-constrained applications with rapid dynamic response is also being showcased. Other motor-drive reference designs include EPC91121 (using the EPC2366), EPC91135 with the EPC2376 for higher-voltage 150V inverter operation, EPC9186HCx with the EPC2361 for scalable high-current three-phase motor-drive architectures, and EPC91128/29/30/31 with the EPC231x family which contain all the necessary critical functions circuits to support a complete motor-drive inverter including gate drivers, regulated auxiliary power rails for housekeeping supplies, voltage, and temperature sense, accurate current sense and protection functions.
High-density DC–DC conversion platforms include EPC91123, 6kW, 800V to 12.5V Isolated Converter Evaluation Board; EPC91134, 11kW, 400/800 Vdc to 50Vdc Isolated Converter; EPC91107 (EPC2304), a 4-level totem-pole PFC delivering 12.5A at 400VDC; EPC90167, a half-bridge evaluation board for EPC2366, and EPC91109 (EPC2057), a compact two-phase synchronous buck converter supporting 20–36V to 12/16/20V conversion — demonstrating efficient front-end and intermediate-bus architectures for compact robotic and aerial power systems.
EPC is also showing, beyond robotics and drones, how GaN technology enables smaller and more efficient electrified platforms such as power tools and e-bikes where higher switching frequency and smaller system size directly translate into better performance, lighter weight and longer run time. Additionally, the firm is demonstrating how the same GaN technology platform enables scalable, high-efficiency power conversion for emerging AI infrastructure, supporting the move to distributed power architectures and higher-density computing environments.
“PCIM Europe is the ideal platform to demonstrate how GaN is driving a new generation of intelligent motion and AI platforms,” comments EPC’s CEO & co-founder Alex Lidow. “Engineers are embedding power electronics into moving and thinking structures, whether those are humanoid robots, drones or AI servers. Our Gen 7 GaN technology enables designers to reduce size and weight, while improving efficiency and reliability — critical requirements for scaling these systems from prototype to production deployments.”
EPC is also hosting special guest Mike Engelhardt, inventor of QSPICE, at its booth in Hall 9, Stand 304, where he is demonstrating how engineers can now simulate EPC GaN discrete devices, half-bridges, and integrated circuits directly in QSPICE.
EPC’s technical experts, including CEO Dr Alex Lidow, are on-site to discuss how GaN is enabling innovation across humanoid robots, drone, power tools, e-bike and AI infrastructure.
Live technical presentations (EPC booth: Hall 9, Stand 304)
9 June (14.45–15.00): ‘Where is GaN Going?’ by EPC’s CEO Alex Lidow;
10 June (11.30–12.00): ‘Building Humanoids and Drones with Scalable Motor Control Architectures’ by Marco Palma, director, Motor Drives Systems and Applications, EPC;
10 June (14.30–15.00): ‘Low Voltage GaN FETs as Synchronous Rectifiers’ by Steve Colino, VP, strategic technical sales, EPC;
10 June (15.00–15.30): ‘Combining EPC Modeling IP with QSPICE Technology’ by Qspice inventor Mike Engelhardt;
11 June (11.00–11.30): ‘Disrupting High Voltage Applications using Low Voltage GaN FETs in Multi-kW Isolated Converters’ by Michael De Rooij, GaN applications fellow, EPC.
Conference presentations
9 June (13.25–14.25: Hall 4, Booth 139): GaN Panel Discussion — ‘Automotive, AI, Humanoid Robots – The future of GaN’ by CEO Alex Lidow;
10 June (15.30–17.00: Poster Session, Hall 4A): ‘Parallel Connection of GaN FET Switching Legs for Modular High-Current Device Applications’ by Marco Palma, director, motor drives systems and applications, EPC, with co-authors Salvatore Musumeci of Polytechnical University of Turin, and Federico Unnia and Simone Scano, EPC, IT;
10 June (15:50–16:10: AI & Data Centers Stage, Hall 5, 320): ‘End-to-End With GaN’ by EPC’s CEO Alex Lidow;
10 June (16:40–17:00: Exhibition Stage, Hall 4A, 320): ‘Making Humanoid Robots and Drones Better with GaN’ by EPC’s CEO Alex Lidow;
11 June (10.50–11.10: Technical Presentation, Stage: Kyiv, Level 2 — Wide Bandgap Semiconductors): ‘Advanced Three-Phase GaN-Based Power Micro-Module for Motor Drives in Robotic Hands’ by Marco Palma, director, motor drives systems and applications, EPC, with co-authors Salvatore Musumeci and Fausto Stella of Polytechnical University of Turin and Francesco Musumeci, EPC, IT;
11 June (11.45–12.45: Technology Stage, Hall 4, Stand 139): Bodo Power Systems Panel — ‘What’s up, what's next for GaN?’ by EPC’s CEO Alex Lidow.
EPC releases 5kW GaN 3-phase inverters for robotics and light EVs
