News: Microelectronics
9 March 2026
Skyworks and MediaTek demo early 6G FR3 and PC1 RF front-end innovations at MWC
Skyworks Solutions Inc of Irvine, CA, USA (which manufactures analog and mixed-signal semiconductors) is showcasing an early 6G new FR3 frequency range RF front-end (RFFE) power amplifier at the Mobile World Congress 2026 (MWC26) in Barcelona, Spain (2–5 March). Presented in collaboration with Taiwanese fabless semiconductor company MediaTek Inc — which designs system-on-chip (SoC) platforms for mobile device, home entertainment, connectivity and IoT products — the live demonstration highlights the companies’ continued efforts to advance next-generation wireless platforms and accelerate access to future 6G technologies.
At MWC26 Hall 3, Stand 3D10, MediaTek is demonstrating a reference design that uses the SKYR60002 advanced 6G FR3 low-noise amplifier (LNA) and power amplifier module with integrated filters designed to support the new 6.425GHz to >7GHz spectrum supported in the latest 3GPP standard. The SKYR60002 6G FR3 LNA power amplifier module with integrated filters supports the high linearity, wide bandwidth support, and robust thermal performance needed to comply with stringent 3GPP standard requirements.
In addition, Skyworks is presenting the SKY58287-11 power amplifier module. This high-efficiency ultra-high-band (UHB) PC1 RFFE module is optimized for MediaTek platforms to address the growing need of network operators to extend the range and performance of their network infrastructure. The power amplifier module uses packaging technology that reduces thermal resistance, eliminating the need for a heat sink and simplifying system design for high-performance fixed wireless and broadband applications. The support for Power Class 1 (PC1) extends the 5G cell-edge coverage for wireless home internet applications.
“6G will introduce a new class of performance requirements, from wider bandwidths and higher frequencies to more advanced air interfaces and system-level efficiency,” notes Evan Su, general manager of MediaTek’s wireless communications business unit. “By working closely with Skyworks on early 6G power amplifier development and reference designs, we are aligning our chipset and RF roadmaps to give the ecosystem superior performance and earlier access to validated, end-to-end platforms. This collaboration helps accelerate innovation and lays the groundwork for future 6G deployments across next-generation wireless applications,” he adds.
“Our collaboration with MediaTek is enabling meaningful progress at the front end of next-generation wireless platforms,” says Joel King, senior VP & general manager of mobile solutions at Skyworks. “By demonstrating both an early 6G FR3 power amplifier and a high-efficiency UHB PC1 solution, we’re showing how close chipset-to-RFFE alignment can enable innovation, accelerate performance, simplify system design, and help customers prepare for what’s next in wireless connectivity.”
Engineering samples of the SKYR60002 6G FR3 6.425GHz to >7GHz LNA power amplifier module with integrated filters and the SKY58287-11 UHB PC1 front-end module will be available to early-access partners in alignment with MediaTek’s chipset evaluation schedule.
MediaTek using Skyworks’ Sky5 suite for sub-6GHz 5G reference platform
