News: Suppliers
4 March 2026
CoolSem establishes Advisory Board to advance wafer-level thermal management
CoolSem Technologies of Eindhoven, the Netherlands (which was founded in 2025 and develops wafer-level thermal management technology to reduce thermal resistance and mechanical stress in advanced semiconductor and photonic devices) has established an Advisory Board to accelerate global growth and technology leadership.
As semiconductor devices face rapidly increasing power densities, thermal management has become a defining bottleneck for system performance and reliability, says CoolSem. To address this challenge at scale, the new Advisory Board combines deep expertise in semiconductor processing, materials science, global operations, strategy, and finance.
The board will support CoolSem in sharpening its technology roadmap, navigating industrialization pathways, and aligning market strategy with the evolving needs of the semiconductor ecosystem.
Satu Lipponen, former executive director at Murata Manufacturing and Nokia and now an independent board professional, has more than three decades of international leadership experience in technology-driven organizations. Reflecting on her role, she emphasizes the importance of translating breakthrough innovation into global value creation, delivering customer promises and scalable business impact with the power of the team.
Fred Roozeboom, an authority in thin-film technology and atomic layer processing, strengthens the board’s deep-technology foundation. With a career spanning Philips Research, NXP Semiconductors, TNO Holst Centre, and the Universities of Eindhoven and of Twente, he has extensive expertise in nano-sized materials engineering and semiconductor process innovation. He underscores the urgency of addressing the rising heat dissipation challenges associated with AI, big data storage, and optical communication: challenges that demand fundamentally new material and thermal management concepts.
Koen Bouwers, an experienced international executive and supervisory board member, adds strategic and financial depth. Having worked with global corporations including Philips and Apple, as well as scaling technology-driven companies through pivotal growth phases, he supports CoolSem in defining strategic direction and financial planning during critical early-stage decisions.
With its WaLTIS multilayer stack, CoolSem replaces conventional substrates with an engineered stack designed to enhance heat flow, mechanical stability and reliability, enabling higher performance and longer lifetime for next-generation devices.
