News: Microelectronics
26 June 2026
Infineon sampling silicon carbide bidirectional switch based on 750V CoolSiC G2 technology
Infineon Technologies AG of Munich, Germany has begun sampling silicon carbide (SiC) bidirectional switches (BDS) built on rugged 750V CoolSiC G2 technology. A vertically integrated dual-die with common drain design in a top-side-cooled Q-DPAK package integrates two power switches into one to simplify design and enable the evolution of legacy topologies. The 750V CoolSiC BDS is said to deliver the reliability margin that modern grids and energy systems demand, resulting in the lowest total cost of ownership during the application lifetime.
Picture: Infineon’s silicon carbide bidirectional switch based on CoolSiC G2 technology.
The 750V CoolSiC BDS offers what is claimed to be best-in-class RDS(on) x Qfr, superior RDS(on) x QOSS, and low Qg, reducing switching and conduction losses for ultra-fast, efficient switching. A VGS(th),typical of 4.5V at 25°C paired with an ultra-low QGD/QGS ratio enhances immunity to parasitic turn-on, while extended gate-bias tolerance of −11V to +25V transient voltage increases design margin and compatibility. Rated at 200V/ns dv/dt, the devices support high-frequency designs without compromising durability. The product portfolio will start from 14mΩ, up to 66mΩ.
Engineered for demanding power systems, the 750V CoolSiC BDS delivers 840V(BR)DSS with superior margin for bus voltages above 500V, proven avalanche resilience, overload endurance up to 200°C for 100 hours, and 2µs short-circuit withstand time. The devices safeguard systems from real-world voltage surges, energy pulses, transient stress, and inrush current – delivering durable, fault-tolerant operation.
The 750V CoolSiC BDS expands Infineon’s top-side-cooled family, enabling native liquid cooling in the most demanding and rapidly evolving applications. New energy-efficiency levels became possible with new design iterations on the topology level.
In automotive applications the devices are suitable for on-board chargers (OBCs) and EV charging as well as eFuse and pre-charge circuits. Paired with the CoolSiC H-DPAK half-bridge, it enables a smooth transition to a single-stage OBC based on SiC technology, delivering high power-dense, space- and cost- efficient designs.
Industrial applications include:
- HVDC AI PSU with native liquid cooling;
- residential solar and storage;
- HVAC for hospitals and onsite data centers;
- CSI drive for eVTOL;
- HVDC protection in power and IT rack;
- humanoid fleet fast charging.
