News: Microelectronics
29 June 2026
Infineon adds two new high-efficiency server power solutions for AI data-center PSUs
With artificial intelligence workloads redefining the power requirements of modern data centers (and rapidly increasing GPU power levels and denser rack configurations pushing server power infrastructure to its limits), Infineon Technologies AG of Munich, Germany has hence introduced two system-level solutions targeting server ODMs and OEMs: an 18kW three-phase power supply unit (PSU) reference design optimized for 50V rack architecture, and a 30kW three-phase interleaved T-Type power factor correction (PFC) evaluation board designed for 800VDC or ±400VDC rack architectures with power sidecar. Both are part of Infineon’s broad AI server power delivery portfolio, helping customers to accelerate time-to-market while achieving higher rack power, improved efficiency, and better thermal performance.
The 18kW PSU reference design introduces a novel integrated energy buffer concept that smooths power draw from the grid during AI peak loads, eliminating the need for a separate capacitor bank unit. This more efficient use of stored energy reduces the required capacitor volume by up to 50%, cutting both component costs and physical footprint. The 30kW PFC evaluation board leverages Infineon’s CoolGaN technology to deliver higher power density at lower system cost, targeting data-center operators scaling up infrastructure to meet surging AI compute demand.
Picture: The 18kW PSU reference design.
The 18kW PSU reference design achieves a peak efficiency of 97.5%, enabled by a carefully optimized combination of Infineon components: 650V CoolSiC MOSFETs, 80V CoolGaN switches, EiceDRIVER gate drivers, and the PSOC microcontroller. At the heart of the power conversion stage is a 5-level active neutral-point clamped (ANPC) PFC topology, which delivers superior efficiency across the full load range, particularly at low-to-mid load, while significantly reducing the volume of magnetic components. Compared to competing topologies, this approach achieves 0.2 percent higher peak efficiency at 50% load than a T-Type PFC, and 0.4 percent higher than a Vienna rectifier.
A novel integrated planar magnetic construction enables a compact, modular and scalable high-frequency transformer design. The energy buffer circuit guarantees a 20ms hold-up time and meets stringent AI load transient requirements, supporting GPU electrical data peak processing (EDPP) loads of up to 180%. The reference design accepts a wide 311–528VAC three-phase input, ensuring compatibility with global grid standards. A robust thermal management design enables reliable operation across an ambient temperature range of –5°C to 45°C. With a compact form factor of 104mm x 710mm x 40mm, the solution fits standard 19-inch rack enclosures and achieves 100W/in3 power density.
Picture: The 30kW T-Type PFC evaluation board.
The 30kW T-Type PFC evaluation board combines 650V CoolGaN bidirectional switches in the back-to-back switching path with 1200V CoolSiC MOSFETs in the high-voltage power stage, delivering a peak efficiency above 99%. Precise current and voltage control with fast dynamic response is achieved through the programmable power control accelerator (PPCA) integrated in the PSOC C3 MCU. The design maintains ultra-low input current total harmonic distortion (iTHD) below 5% for loads above 30%, and a power factor exceeding 0.99 across most of the operating load range.
Current sensing is handled by the XENSIV TLE4978 isolated magnetic Hall + Coil current sensor, which combines a 9MHz bandwidth with robust common-mode transient immunity (CMTI) and high accuracy, making it suited to next-generation SiC- and GaN-based power supply designs. The modular platform is designed for integration into a 1U full-size PSU form factor, targeting HVDC data-center applications that require precise voltage regulation and strong thermal performance under the dynamic and demanding conditions of AI workloads.
Both designs are optimized for use with Infineon’s broad AI server power delivery portfolio, spanning the full power chain from grid to core. This includes solid-state transformers and circuit breakers, power supply and battery backup units, intermediate bus converters, and second-stage DC conversion power modules. By combining the complementary strengths of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN), Infineon says that it offers customers a clear, proven path to end-to-end power architectures. The portfolio is supported by consistent design resources and scalable, high-quality components tailored to next-generation AI server platforms.
Both the 18kW three-phase PSU reference design and the 30kW three-phase T-Type PFC evaluation board will be available for evaluation soon.
Infineon releases 12kW high-density PSU reference design for AI data centers and servers
Infineon unveils roadmap for power supply units in AI data centers
