News: Suppliers
23 June 2026
MIT Lincoln Lab buys Aixtron Hyperion 300mm MOCVD systems
Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany says that the Massachusetts Institute of Technology (MIT) Lincoln Laboratory has purchased two Hyperion 300mm metal-organic chemical vapor deposition (MOCVD) systems as part of a partnership made possible by the Massachusetts Governor’s Office and the Northeast Microelectronics Coalition (NEMC). The systems will support research on gallium nitride (GaN) power electronics, radio-frequency applications, and next-generation two-dimensional materials, and will be available to users across the NEMC ecosystem and beyond.
The two Hyperion systems will be installed at the MIT Lincoln Laboratory and configured primarily for 200mm wafer processing, while retaining full processing capability for substrates up to 300mm. This flexibility will allow researchers to work across multiple wafer sizes and support the transition of promising materials and device concepts toward larger-scale manufacturing environments.
One Hyperion system will be used for GaN power and RF device development, including the exploration of novel barrier structures and advanced material concepts for next-generation high-performance devices. The second system will be dedicated to 2D materials research, targeting applications such as next-generation transistors and remote epitaxy.
“This milestone marks another important step for Aixtron’s technology and for the broader integration of GaN and 2D materials into silicon-based manufacturing environments,” says Aixtron’s CEO Dr Felix Grawert. “The Hyperion 300mm platform combines scalable wafer capability with high process flexibility, making it well suited for MIT Lincoln Laboratory’s cutting-edge research in two of the most promising fields of advanced microelectronics,” he adds. “Its versatility supports the development of next-generation materials and helps create a pathway from research to future industrial application.”
This project builds on Massachusetts’ commitment to strengthening domestic semiconductor innovation through the NEMC Hub. By supporting strategic equipment investments at leading research institutions, NEMC’s SCALE Capital Program aims to accelerate breakthroughs in advanced microelectronics and foster closer collaboration between academia, government and industry. The program is supported by funding from the Healey-Driscoll Administration and the Northeast Microelectronics Coalition Hub.
Construction contract awarded for CSL-MIF at MIT Lincoln Laboratory
