News: Microelectronics
29 January 2026
Wolfspeed unveils TOLT package portfolio
Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has introduced its new TOLT package portfolio, which enables maximum power density in a power supply for data-center rack applications.
Built on Wolfspeed’s Gen 4 MOSFET technology, the TOLT (TO-Leaded, Top-Side Cooled) package is engineered to release heat from the top side of the package, making cooling far more efficient. This enables companies to build smaller, more reliable power systems that support the rising demands of AI data centers.
Picture: Wolfspeed’s new TOLT package.
“AI is pushing data-center OEMs to be incredibly strategic about the size and total efficiency of their power systems,” notes Guy Moxey, vice president of Wolfspeed’s Industrial & Energy business. “Our TOLT product family offers a straightforward path to delivering higher-density, thermally optimized power systems capable of sustaining the demands of AI data centers, and Wolfspeed’s Gen 4 technology helps these systems run cooler, more efficiently, and more reliably.”
Wolfspeed’s 650V TOLT products are available in a variety of on-resistances (RDSON).
TOLT joins the previously released U2 portfolio as the second of three Wolfspeed top-side cooled package families, aimed at one of the fastest-growing industry segments.
More details on the third top-side-cooled portfolio from Wolfspeed will be shared in second-half 2026.
