News: Suppliers
18 August 2026
Coherent sampling 300mm high-thermal-conductivity silicon carbide
Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has begun sampling its 300mm high-thermal-conductivity silicon carbide (SiC) substrates to leading AI semiconductor partners, advancing its scalable materials platform for the growing thermal management requirements of artificial intelligence (AI) and high-performance computing (HPC) systems.
As AI processors move toward higher power densities, effective heat removal is becoming a primary constraint on system performance, reliability, and data-center efficiency. Customer sampling moves Coherent’s 300mm SiC platform from internal development to customer evaluation across the AI semiconductor ecosystem.
Silicon carbide combines high thermal conductivity, mechanical strength, and thermal stability for next-generation heat spreaders and related packaging solutions. Coherent says that its vertically integrated capabilities in SiC crystal growth, wafering, polishing, and characterization provide control across the production process and support progression toward future high-volume manufacturing. The high-thermal-conductivity substrates are engineered to improve heat spreading by up to 25% more than current solutions while maintaining compatibility with existing semiconductor manufacturing platforms.
“AI performance is increasingly constrained by the industry’s ability to remove heat from next-generation processors,” says Craig Mullaney, senior VP & general manager at Coherent. “Advanced SiC thermal management materials can play an important role in addressing that challenge. By combining decades of silicon carbide expertise with a scalable 300mm manufacturing platform, Coherent is helping build the materials foundation for future AI infrastructure.”
This milestone marks the next step in Coherent’s roadmap to expand its 300mm SiC platform for AI and high-performance computing. By combining customer engagement, vertically integrated materials expertise, and a scalable manufacturing strategy, the firm is positioning its SiC capabilities to support successive generations of AI infrastructure.
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