News: Optoelectronics
29 September 2025
Marvell showcasing interconnect portfolio for accelerated infrastructure at ECOC
On stand #C4134 at the European Conference on Optical Communication (ECOC 2025) in Copenhagen, Denmark (28 September–2 October), data infrastructure semiconductor solutions provider Marvell Technology Inc of Santa Clara, CA, USA is showcasing its interconnect portfolio for scale-up and scale-out data-center AI deployments.
The rapid evolution of generative AI technologies and large-scale models is redefining data-center architectures, driving unprecedented demand for interconnect performance, bandwidth and power efficiency, notes Marvell. This transformation is accelerating the need for high-performance silicon, advanced memory architectures and tightly integrated optical connectivity. As hyperscalers scale massive AI compute clusters across racks, campuses and multi-site topologies, interconnect technologies must be developed to deliver efficiency, scalability and workload-optimized performance.
Marvell is addressing this challenge with a full-stack approach — combining advanced silicon platforms, chiplet-based architectures and optical technologies. Together, these innovations are said to unlock new levels of performance across scale-up and scale-out fabrics, reduce latency, lower power consumption, and enable faster deployment at cloud scale.
At ECOC, Marvell is showcasing technologies that will drive the next generation of AI interconnects, including:
- Co-packaged optics (CPO) for AI scale-up: a CPO platform supporting 200G/lane connectivity for energy-efficient, high-bandwidth links spanning multiple racks within an AI scale-up domain.
- Marvell COLORZ 800G ZR/ZR+ for multi-site AI training: an industry-first family of 800Gbps ZR/ZR+ coherent pluggable optical modules that supports transmission up to 2000km, enabling cost-effective, scalable data-center interconnect (DCI) between geographically distributed AI clusters.
- 200G/lambda 1.6T PAM4 optical interconnect: Marvell Ara, the industry-first 3nm PAM4 DSP, combines eight 200Gbps channels inside a single optical module, enabling rapid deployment of AI scale-out fabrics across rows and data halls.
Marvell experts are also delivering presentations on interconnect technologies designed to scale accelerated infrastructure:
- 29 September (10:20–10:35am CET) — Market Focus: ‘Outlook for Coherent Lite Technologies and Markets’ by Bo Zhang (senior principal engineer, Marvell);
- 29 September (12–12:30pm CET) — Product Focus: ‘800G Coherent DSP and Beyond’ by Bo Zhang (senior principal engineer, Marvell);
- 29 September (4–4:30pm CET) — Product Focus: ‘Revolutionizing Rackscale Connectivity Using Co-packaged Copper & Optics’ by Rohan Gandh (product management, Switch, at Marvell) and Matthew Burns (director of technical marketing, Samtec);
- 2 October (9:30–10pm CET) — ‘Impact of Equalizer-Enhanced Phase Noise for Coherent Pluggables’ by Hai Xu (distinguished engineer).
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