News: Suppliers
9 September 2025
Axcelis launches Purion Power Series+ ion implant platform for SiC power devices
Ion implantation system maker Axcelis Technologies Inc of Beverly, MA, USA has launched the Purion Power Series+ ion implant product platform, designed specifically to enable improved device performance and increase productivity for next generation power devices, including emerging superjunction architectures.
The new Purion Power Series+ spans the full ion implant market space with new product line extensions and upgrades that include the Purion H200+ SiC for high-current medium-energy applications, Purion M+ SiC for medium-current applications and the Purion XE+ SiC and Purion EXE+ SiC for high-energy applications.
Picture: Axcelis' new Purion Power Series+ ion implant product platform.
“Axcelis has a long history of collaborating closely with our customers to develop innovative solutions for their high-value challenges,” says executive VP Dr Greg Redinbo. “The Purion Power Series+ family is uniquely suited to address these challenges due to its innovative platform that offers the flexibility to handle multiple wafer sizes (150mm and 200mm), substrate types (including SiC, Si, GaN, and GaAs wafers) and implant temperatures (room temperature, warm and hot). This is accomplished while also delivering the industry’s highest throughput and capital efficiency,” he claims.
“Axcelis was first to market with a full portfolio of implanters with innovative capabilities specifically to address high-volume manufacturing needs for the power device industry,” says president & CEO Dr Russell Low. “Evolving power device roadmaps are now driving the rapid transition to new technical and production requirements. Axcelis’ Purion Power Series+ platform is the next generation of ion implant solutions designed specifically to meet these challenges across the full spectrum of existing and emerging applications.”
Axcelis at ICSCRM 2025
At the International Conference on Silicon Carbide and Related Materials (ICSCRM 2025) at the Bexco Convention Center in Busan, South Korea (14-19 September), Axcelis is promoting the launch of the Purion Power Series+ and GSD Ovation ES platforms, designed specifically to enable improved device capability and productivity for next-generation power devices for all single-wafer and batch applications.
Also, Axcelis technologists and collaborators are presenting the following topics during the ICSCRM technical forum:
- ‘Path for Superjunction Industrialization by Single Step High Energy Channeling Implant’, presented by Dr Fulvio Mazzamuto of Axcelis;
- ‘Development of High Energy Channeling Implantation Process for SiC Superjunction Devices’, presented by Dr Reza Ghandi of GE Global Research;
- ‘Effect of Silicon and Oxygen Pre-Implantation on Thermal Oxidation of 4H-SiC’, presented by Dr Enrico Sangregorio of CNR IMM.
Axcelis ships Purion EXE SiC implanter to new power device customer in Japan
Axcelis ships Purion H200 SiC Power Series ion implanter to Wolfspeed
Axcelis ships full family of Purion SiC Power Series implanters to power device makers
