News: Microelectronics
16 October 2025
ST unveils prototype power delivery system for NVIDIA’s 800VDC power architecture
STMicroelectronics of Geneva, Switzerland has unveiled a complete prototype of its new power delivery system as it develops new chip designs supporting the 800VDC power architecture announced by NVIDIA of Santa Clara, CA, USA for next-generation AI data centers.
The rapid growth of AI workloads is creating unprecedented power demands in data centers, notes ST. Traditional 54V power distribution systems, designed for kilowatt-scale racks, are insufficient for the needs of emerging megawatt-scale AI compute racks. To address this, NVIDIA is working with the ecosystem on the 800VDC power architecture, which supports megawatt-scale compute racks while improving efficiency, reducing copper usage, and simplifying infrastructure.
ST says that it is actively developing the essential chip technologies for 800VDC architectures, leveraging its diverse power chip portfolio that combines silicon carbide (SiC), gallium nitride (GaN) and silicon technologies and advanced custom design at both the chip and package levels.
At the 2025 OCP Global Summit in San Jose, CA, USA, ST shared a key milestone with the development of a compact 12kW power delivery board that is approximately the size of a smartphone. The 12kW GaN-based LLC converter, operating at an 800V input and a 1MHz switching frequency, has successfully completed full-power testing, delivering continuous 12kW output power with over 98% efficiency and a power density exceeding 2600W/in3 at 50V.
The solution addresses the fundamental challenges of power density, efficiency, thermal management, and reliability, which are essential for deploying megawatt-scale AI compute racks while reducing infrastructure complexity and total ownership costs.
