News: Microelectronics
20 October 2025
Infineon launches CoolSiC MOSFETs 1400V G2 in TO-247PLUS-4 Reflow package
Infineon Technologies AG of Munich, Germany has launched the CoolSiC MOSFETs 1400V G2 in the TO-247PLUS-4 Reflow package, supporting higher DC-link voltages and enabling improved thermal performance, reduced system size and enhanced reliability.
Picture: Infineon’s CoolSiC MOSFETs 1400V G2 in the TO-247PLUS-4 Reflow package.
The new devices are targeted at addressing new design challenges (including reliable operation under harsh environmental conditions, robustness against transient overloads, and optimized overall system performance) for high-power applications such as electric vehicle charging, battery energy storage systems, and commercial, construction and agricultural vehicles (CAVs), which are driving the demand for higher system-level power density and efficiency to meet increasing performance expectations.
The package technology supports reflow soldering at 260°C for up to three cycles and enables reliable operation with junction temperatures up to 200°C, while ensuring high peak current capability. Leveraging the Infineon .XT interconnection technology, the devices deliver improved thermal performance and enhanced mechanical robustness for demanding environments. The new 1400V voltage class provides additional margin for faster switching and simplifies protection measures against overvoltage. This eliminates the need for power de-rating and contributes to overall system robustness.
The CoolSiC MOSFETs 1400V G2 in the TO-247PLUS-4 Reflow package are available in RDS(on) classes from 6mΩ to 29mΩ. Infineon also offers CoolSiC MOSFETs 1400V in a TO-247-4 package with high creepage. RDS(on) classes for this portfolio range from 11mΩ to 38mΩ, with devices suitable also for applications such as photovoltaic.
