News: Microelectronics
16 May 2025
Sivers renews debt financing with US-headquartered bank to support growth strategy
In a “a significant step” in its ongoing growth and financial strategy, Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs for SATCOMs and photonic lasers for AI data centers) has renewed its debt financing, securing a new three-year term loan with annual refinancing capability. The agreement is in partnership with a US-headquartered bank.
The new loan will facilitate refinancing of the company’s existing debt, which was previously scheduled to mature in May. The renewal is said to provide substantially better terms, enhanced financial flexibility and support Sivers’ ongoing strategic focus and market objectives.
“We are pleased to have established a long-term partnership for our debt financing strategy and working capital needs,” says CEO Vickram Vathulya. “We have secured attractive terms and have aligned interests as we pursue exciting growth opportunities for Sivers’ wireless and photonics businesses.”
In connection with the new loan agreement, Sivers will issue 3,318,029 warrants to the lender at a subscription price of SEK4.53 per share. The warrants have a term of five years, providing additional potential for capital raising and aligning the interests of stakeholders with the company’s long-term growth.
The refinancing strengthens the Sivers’ capital structure and underlines the confidence financial institutions have in its long-term vision and performance, reckons the firm.
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