News: Microelectronics
9 May 2025
Infineon and Visteon collaborate on power conversion systems for EVs
Infineon Technologies AG of Munich, Germany and automotive cockpit electronics supplier Visteon Corp of Van Buren Township, MI, USA have signed a memorandum of understanding (MOU) to advance the development of next-generation electric vehicle powertrains.
The firms will collaborate and integrate power conversion devices based on Infineon semiconductors, with particular emphasis on wide-bandgap device technologies, which provide significant advantages in power conversion applications compared with silicon-based semiconductors. These include greater power density, efficiency and thermal performance, which contribute to improved efficiency and reduced system costs for next-generation power conversion modules for the automotive sector.
Future Visteon EV powertrain applications incorporating Infineon CoolGaN (gallium nitride) and CoolSiC (silicon carbide) devices may include battery junction boxes, DC–DC converters and on-board chargers. The resulting powertrain systems will conform to the highest efficiency, robustness and reliability, the firms say.
“Working with Infineon allows us to integrate cutting-edge semiconductor technologies that are essential in improving power conversion efficiency and overall system capability of next-generation electric vehicles,” says Dr Tao Wang, head of Visteon’s Electrification product line. “This collaboration will advance technologies that accelerate the transition to a more sustainable and efficient mobility ecosystem,” he adds.
“Visteon is a recognized innovator and an early adopter of new technologies, making them an ideal partner for us,” comments Peter Schaefer, Infineon’s chief sales officer Automotive.
