News: Microelectronics
6 May 2025
Infineon introduces new CoolSiC JFET technology for smarter and faster solid-state power distribution
To enable the next generation of solid-state power distribution systems, Infineon Technologies AG of Munich, Germany is expanding its silicon carbide (SiC) portfolio with the new CoolSiC JFET product family.
The new devices are said to deliver minimized conduction losses, solid turn-off capability, and high robustness, making them suitable for advanced solid-state protection and distribution. With robust short-circuit capability, thermal stability in linear mode, and precise overvoltage control, CoolSiC JFETs are claimed to enable reliable and efficient system performance in a wide range of industrial and automotive applications, including solid-state circuit breakers (SSCBs), AI data-center hot-swaps, eFuses, motor soft starters, industrial safety relays, and automotive battery disconnect switches.
Picture: Infineon’s new CoolSiC JFET product family.
“With CoolSiC JFET, we are addressing the growing demand for smarter, faster and more robust power distribution systems,” says Dr Peter Wawer, division president Green Industrial Power at Infineon. “This application-driven power semiconductor technology is specifically designed to provide our customers with the tools they need to solve the complex challenges in this rapidly evolving space,” hee adds. “We are proud to introduce devices that achieve best-in-class RDS(ON), setting a new standard for SiC performance.”
The first generation of CoolSiC JFETs features ultra-low RDS(ON) starting at 1.5mΩ (750VBDss) and 2.3mΩ (1200VBDss), significantly reducing conduction losses. The bulk-channel optimized SiC JFET offers high robustness under short-circuit and avalanche failure conditions. Housed in a Q-DPAK top-side-cooled package, the devices support easy paralleling and scalable current handling, enabling compact, high-power systems with flexible layout and integration options. Their predictable switching behavior under thermal stress, overload and fault conditions provides maximum long-term reliability in continuous operation.
To meet the thermal and mechanical challenges of harsh application environments, CoolSiC JFETs leverage Infineon’s advanced .XT interconnection technology with diffusion soldering. This significantly improves transient thermal impedance and robustness under pulsed and cyclic loads typical of industrial power systems. Tested and qualified under real-world operating conditions of solid-state power switches and based on the industry-standard Q-DPAK package, the devices enable quick and seamless design integration in both industrial and automotive applications.
Engineering samples of the new CoolSiC JFET family will be available later in 2025, with volume production starting in 2026. The product portfolio will be further expanded with a variety of packages and modules.
The product family is being demonstrated in booth #470 (Hall 7) at the Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM 2025) Expo & Conference in Nuremberg, Germany (6–8 May).
