News: Microelectronics
2 May 2025
Infineon adds EasyPACK CoolGaN power modules for high-voltage applications
With the rapid growth of AI data centers, the increasing adoption of electric vehicles, and the ongoing trends in global digitalization and reindustrialization, global electricity demand is expected to surge. To address this challenge, Infineon Technologies AG of Munich, Germany is introducing the EasyPACK CoolGaN Transistor 650V module, adding to its growing GaN power portfolio. Based on the Easy Power Module platform, the module has been specifically developed for high-power applications such as data centers, renewable energy systems, and DC electric vehicle charging stations. It is designed to meet the growing demand for higher performance while providing maximum ease of use, helping customers to accelerate their design processes and shorten time-to-market.
“The CoolGaN-based EasyPACK power modules combine Infineon’s expertise in power semiconductors and power modules,” says Roland Ott, senior VP & head of Infineon’s Green Energy Modules and Systems business unit. “This combination offers customers a solution that meets the increasing demand for high-performance and energy-efficient technologies in applications such as data centers, renewable energy, and EV charging.”
Picture: CoolGaN power semiconductors in the EasyPACK package.
The EasyPACK CoolGaN module integrates 650V CoolGaN power semiconductors with low parasitic inductances, achieved through compact die packing, enabling fast and efficient switching. Delivering up to 70kW per phase with just a single module, the design supports compact and scalable high-power systems. Furthermore, by combining Infineon’s .XT interconnect technology with CoolGaN options, the module is said to enhance both performance and reliability. The .XT technology is implemented on a high-performance substrate, significantly reducing thermal resistance, which in turn translates to higher system efficiency and lower cooling demands. This results in increased power density and excellent cycling robustness, even under demanding operating conditions. With support for a broad range of topologies and customization options, the EasyPACK CoolGaN module addresses diverse requirements in industrial and energy applications.
EasyPACK modules
Infineon has sold well over 70 million EasyPACK modules with various chipsets for a wide range of industrial and automotive applications. With the introduction of the CoolGaN power semiconductors in this package, Infineon is now expanding the application range of GaN as its use creates more demand into very high kilowatt applications. The EasyPACK series leverages Infineon’s PressFIT contact technology, which ensures highly reliable and durable electrical connections between the module and the PCB. By utilizing a cold-welding process, PressFIT delivers gas-tight, solder-free joints that guarantee long-term mechanical stability and electrical conductivity, even under demanding thermal and mechanical conditions. This advanced design reduces manufacturing time and eliminates potential solder-related defects, offering a robust solution for high-reliability applications. Additionally, with its compact design, EasyPACK modules occupy up to 30% less PCB surface area than other conventional discrete layouts, resulting in a very cost-effective solution.
CoolGaN Transistors 650V G5
The newest 650V CoolGaN generation provides increased performance and figures of merit. Infineon’s benchmark data shows that CoolGaN Transistor 650V G5 products provide up to 50% lower energy stored in the output capacitance (Eoss), up to 60% improved drain-source charge (Qoss) and up to 60% lower gate charge (Qg). Combined, these features result in increased efficiencies in both hard- and soft-switching applications. This leads to a significant reduction in power loss compared with traditional silicon technology, ranging from 20% to 60% depending on the specific use-case. The CoolGaN Transistor 650V G5 product family offers a wide range of RDS(on) package combinations. Ten RDS(on) classes are available in various SMD packages, such as ThinPAK 5x6, DFN 8x8, TOLL and TOLT. All products are manufactured on high-performance 8-inch production lines in Villach (Austria) and Kulim (Malaysia). Target applications range from consumer and industrial switched-mode power supplies (SMPS) such as USB-C adapters and chargers, lighting, TV, data center and telecom rectifiers to renewable energy and motor drives in home appliances.
Infineon is showcasing the EasyPACK modules with CoolGaN in booth Hall 7, booth 470 at the Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM 2025) Expo & Conference in Nuremberg, Germany (6–8 May).
Infineon launches CoolGaN Transistors 650V G5 product family
