News: Microelectronics
5 December 2025
onsemi releases EliteSiC MOSFETs in T2PAK top-cool package
Intelligent power and sensing technology firm onsemi of Scottsdale, AZ, USA has released its EliteSiC MOSFETs in the industry-standard T2PAK top-cool package, advancing power packaging for automotive and industrial applications. The new product delivers enhanced thermal performance, reliability and design flexibility for demanding high-power, high-voltage applications for markets including electric vehicles, solar infrastructure, and energy storage systems.
onsemi’s latest portfolio of 650V and 950V EliteSiC MOSFETs in T2PAK packaging combines the firm’s silicon carbide technology with top-cool packaging. Initial devices are shipping to lead customers, with additional products planned for fourth-quarter 2025 and beyond. By introducing the T2PAK across its EliteSiC family, onsemi is offering a new option for automotive and industrial customers seeking efficiency, compactness and durability in demanding high-voltage applications.
With rising power requirements in applications such as solar inverters, EV chargers, and industrial power supplies, effective thermal management has become a critical engineering challenge, notes onsemi. Conventional packaging often forces designers to choose between thermal efficiency and switching performance. The EliteSiC T2PAK solution addresses this issue by efficiently transferring heat from the printed circuit board (PCB) directly into the system’s cooling infrastructure, enabling superior performance without compromise. This results in:
- superior thermal efficiency and reduced operating temperatures;
- lower component stress, extending system lifetime;
- higher power density and compact system design;
- simplified system design to achieve faster time to market.
“Thermal management is one of the most critical challenges facing power systems designers in automotive and industrial markets today… seeking solutions that deliver efficiency and reliability without compromise,” says Auggie Djekic, VP & head of onsemi’s SiC Division. “With our EliteSiC technology and the innovative T2PAK top-cool package, customers can unlock superior thermal performance and design flexibility, empowering them to create next-generation products that stand out in today’s competitive landscape,” he adds.
The T2PAK’s top-cool package delivers an optimal balance of heat dissipation and switching performance by enabling direct thermal coupling between the MOSFET and the application heatsink. This design minimizes junction-to-heatsink thermal resistance and supports a wide range of Rds(on) options (12mΩ to 60mΩ), providing enhanced design flexibility. Key technical highlights include:
- superior thermal performance by channeling heat directly into the system’s heatsink, bypassing the PCB thermal limitations;
- maintains low stray inductance, enabling faster switching speeds and reduced energy losses;
- combines the benefits of both TO-247 and D2PAK without significant drawbacks.
onsemi summarizes that, with EliteSiC’s superior figure of merit in a T2PAK top-cool package, designers can achieve more compact, cooler and higher-efficiency systems.
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