News: Suppliers
17 December 2025
NHanced supporting mixed-material heterogeneous hybrid bonding production with copper or nickel bonds
NHanced Semiconductors Inc of Batavia, IL (the first US-based pure-play advanced packaging foundry) says that it uniquely supports mixed-material hybrid bonding with either copper or nickel bonds. Its new Besi bonding system further expands its advanced packaging yield and throughput.
NHanced announced earlier this year that it had taken delivery of the first Datacon 8800 CHAMEOultra plus hybrid bonding system from BE Semiconductor Industries NV (Besi) of Duiven, The Netherlands, at its advanced packaging facility in Morrisville, NC.
The Besi Datacon 8800 CHAMEO ultra plus is described as an advanced hybrid bonding system that cost-effectively addresses increased demands for performance, speed, accuracy and warpage control in fine-pitch copper interconnects with submicron pad sizes. Based on Besi’s field-proven Datacon platform, the Datacon 8800 CHAMEO ultra plus hybrid bonder supports room temperature direct fusion bonding of dielectric followed by batch annealing to complete electrical connections and incorporates state-of-the art vision systems.
Picture: The Besi Datacon 8800 CHAMEO ultra plus system.
The new bonding system represents the latest in ongoing investments by NHanced to expand its advanced packaging production. Among its suite of technologies, NHanced delivers the Direct Bond Interconnect (DBI) room temperature hybrid bonding process that joins wafers, dies and chiplets with both dielectric covalent bonds and metal-to-metal fusion bonds. DBI produces what is claimed to be unmatched fine-grained interconnects for 2.5D and 3D assemblies. NHanced has uniquely expanded its DBI process capabilities to include heterogeneous integration of gallium nitride (GaN), gallium arsenide (GaAs), indium phosphide (InP), lithium niobate (LiNbO3), glass, and diamond substrates, and is the only company offering both copper and nickel for bonding.
“NHanced has already successfully delivered more hybrid bonding products than anyone else in the industry,” claims president Robert Patti. “The new Besi system significantly expands the hybrid bonding capabilities of our Morrisville, NC facility.”
NHanced is the first pure-play advanced packaging foundry to operate this Besi hybrid bonding platform – a key enabler for ultra-precise die-to-wafer alignment of 200nm with interconnect pitches down to 1µm. The system can process up to 2000 dies per hour, resulting in ~10x faster throughput with increased yields and superior warpage control.
NHanced says that it has pioneered a ‘Foundry 2.0’ paradigm shift in semiconductor manufacturing – applying foundry processes and advanced packaging & assembly technologies to dies and chiplets sourced from traditional foundries. The results are customized 3D IC and 2.5D advanced packaging and interposer assemblies. NHanced claims that it is the only US-based foundry that can support this manufacturing model.
