News: Microelectronics
15 December 2025
CHIPX to establish 8-inch GaN-on-SiC wafer fab in Malaysia
Semiconductor and photonics manufacturer CHIPX of Dublin, Ireland plans to establish an 8-inch wafer fabrication facility in Malaysia, the first of its kind in the ASEAN (Association of Southeast Asian Nations) region. The facility will introduce gallium nitride on silicon carbide (GaN/SiC) manufacturing, driving Malaysia’s entry into front-end semiconductor production and accelerating domestic capability in photonics, high-bandwidth optical interconnects, and advanced materials engineering essential to next-generation AI and high-performance compute systems.
CHIPX says that its vertically integrated platform combines advanced materials, high-voltage ICs, and system-level design to deliver resilient, performance-driven technologies.
CHIPX is establishing front-end manufacturing capabilities in Malaysia, spanning infrastructure, R&D, engineering teams, talent development programs, and structured technology-transfer initiatives that build local expertise. Leveraging Malaysia’s emerging silicon photonics ecosystem, CHIPX aims to provide the fabrication foundation for next-generation transceivers and receivers, enabling ultra-high-speed connectivity for AI data centers and intelligent systems.
“Malaysia is emerging as a leader in the next wave of semiconductor and photonics innovation,” says CHIPX’s CEO & founder Chinmoy Baruah. “We are bringing advanced front-end manufacturing and photonics capabilities to Malaysia to accelerate the country’s move into front-end semiconductor production and to establish the ultra-high-bandwidth, energy-optimized compute architectures required to scale the next generation of AI systems.”
CHIPX is executing the venture with strategic international investors and leading Taiwanese semiconductor partners to bring advanced engineering depth into Malaysia’s semiconductor ecosystem. Reflected in this collaboration is CHIPX’s long-term commitment to building high-performance, energy-optimized front-end semiconductor capabilities in the region.
The project aligns with Malaysia’s key industrial policy frameworks – including the National Semiconductor Strategy, the New Industrial Master Plan (NIMP 2030), and the National Energy Transition Roadmap – by supporting national efforts to develop a resilient, competitive, and sustainable semiconductor sector.
