12 January 2023
Infineon signs new SiC material multi-year supply and cooperation deal with Resonac
Infineon Technologies AG of Munich, Germany is extending its cooperation with silicon carbide (SiC) suppliers by signing a new multi-year-supply and cooperation agreement with Tokyo-based wafer manufacturer Resonac Corp (formerly Showa Denko K.K. until its integration with Showa Denko Materials Co Ltd on 1 January), complementing and expanding the announcement of 2021. The new set of contracts will deepen the long-term partnership on SiC material. Resonac will supply Infineon with SiC materials for the production of SiC semiconductors, covering a double-digit share of the forecasted demand for the next decade.
While the initial phase focuses on 6”-wafer SiC material supply, Resonac will also support Infineon’s transition to 8” wafer diameter during the later years of the agreement. As part of the cooperation, Infineon will provide Resonac with intellectual property relating to SiC material technologies. The Infineon-Resonac partnership is intended to contribute to supply chain stability.
”Demand for SiC is growing rapidly and we are preparing for this development with a significant expansion of our manufacturing capacities,” says Infineon’s chief procurement officer Angelique van der Burg. “We are pleased to deepen our collaboration with Resonac and strengthen the partnership between our two companies,” she adds.
“The business opportunities in the area of renewable energy generation and storage, electro-mobility and infrastructure are enormous for the years to come,” says Peter Wawer, president of Infineon’s Industrial Power Control division. “Infineon is doubling down on its investments into SiC technology and product portfolio, to proliferate the most comprehensive product offering to its customers… Our partnership with Resonac will strongly support our market-leading position,” he adds.
“We are pleased to team-up with Infineon as a global leader in power semiconductors in order to meet the growing demand for SiC in the years to come. We will continuously improve our best-in-class SiC material and develop the next generation of 8” wafer technology. We value Infineon as an excellent partner in this regard," says Jiro Ishikawa, executive adviser for Resonac’s Device Solutions business unit.
Infineon is expanding its SiC manufacturing capacity in order to reach a market share of 30% by the end of the decade. The firm’s SiC manufacturing capacity is about to increase tenfold by 2027. A new plant in Kulim is scheduled to start production in 2024. Infineon already provides SiC semiconductors to more than 3600 customers worldwide.