AES Semigas


21 July 2022

MRSI and Lumentum collaborate on developing automotive LiDAR solutions

MRSI Systems (Mycronic Group) of North Billerica, MA, USA (which makes fully automated, high-precision, high-speed eutectic and epoxy die bonding systems) has announced a new collaboration with photonics chip and module designer and manufacturer Lumentum Operations LLC to develop light detection and ranging (LiDAR) solutions for the automotive industry.

With LiDAR technology becoming standard equipment in mid-range and high-end vehicles, it is forecasted that, in the next five years, the demand for automotive LiDAR in advanced driver assistance systems (ADAS) will grow at a compound annual growth rate (CAGR) of 94%. Compared to optical transceivers, automotive LiDAR needs to pass more stringent reliability verification, in which both the reliability of the photonic chips and their assembly technologies are critical. Assembling photonic chips with high reliability and zero defects in large-scale production is one of the great challenges facing the emerging automotive LiDAR industry, notes MRSI.

Based on its expertise in providing reliable diode laser solutions for communication and consumer applications, Lumentum has developed a series of diode laser products that meet the quality, scope and reliability requirements of the automotive industry. The firm provides 1550nm narrow-linewidth distributed Bragg reflector (DBR) diode lasers for frequency-modulated continuous wave (FMCW) coherent LiDAR, 905nm and 940nm VCSEL arrays with corresponding power for long-distance LiDAR and in-cabin monitoring.

As a supplier of fully automated high-accuracy die bonders providing high-precision, high-flexibility, high-reliability and high-speed fully automatic chip assembly for the optoelectronic and microelectronic industries, for the automotive LiDAR industry MRSI provides high-reliability and fully automated assembling solutions for various die bonding processes.

To be highlighted at the 2022 Compound Semiconductor Advanced Technology & Application conference in Suzhou, China (3-4 August), MRSI’s collaboration with Lumentum will provide high-reliability photonic chip assembly and services for the automotive LiDAR industry. On behalf of both companies, MRSI’s Dr Limin Zhou is delivering the presentation ‘Discussion on Photonic Chips and Assembling Technologies in Automotive LIDAR’, focusing on the companies’ collaborative work, including key assembly requirements and technologies, best mass-production solutions for high-reliability and zero defects, and experimental results.

“Reliability is critical for automotive LiDAR applications and both the laser chip and the module assembly technology are essential to passing the strict reliability requirements for vehicles,” says Lu Yong, senior product line manager at Lumentum. “Our combined efforts will better support customers with a complete solution that includes high-reliability laser chip and assembly products,” he adds.

“MRSI Systems, Mycronic Group will have more opportunities to work with the global leading photonics company to develop high-reliability chip assembly solutions for the fast-growing industry,” says Dr Yi Qian, Mycronic Group’s VP & general manager for MRSI Systems. “The end-to-end solutions from chip to module assembly provided by our collaboration will shorten time-to-market and play a very important role in enabling mass production of automotive LiDAR solutions.”

See related items:

IQE announces multi-year, high-volume strategic epiwafer supply agreement with Lumentum

Tags: Die Bonder




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