Temescal

Semigas

CLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIACLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIA

Join our LinkedIn group!

Follow ST on Twitter

IQE

13 March 2019

StratEdge displaying post-fired, molded ceramic and ceramic QFN packages at IMAPS Device Packaging, APEC and GOMACTech conferences

StratEdge of San Diego, CA, USA is displaying its high-frequency, high-speed, thermally efficient packages and assembly packaging services at the IMAPS Device Packaging, APEC, and GOMACTech conferences in March. The firm says that its packages meet the extreme demands of high-frequency, high-power gallium nitride (GaN) and gallium arsenide (GaAs) devices and the critical requirements of the telecom, mixed-signal, VSAT, broadband wireless, satellite, military, test & measurement, automotive, down-hole, and MEMS markets.

At the International Microelectronics Assembly and Packaging Society’s (IMAPS) Device Packaging Conference in Fountain Hills, AZ, USA (5-6 March), StratEdge showcased its post-fired ceramic, low-cost molded ceramic and ceramic QFN packages, and highlighted StratEdge Assembly Services as well as the firm’s new ISO 9001:2015 facility (which incorporates a Class 1000 cleanroom plus Class 100 work areas with ESD control for performing sensitive operations).

In booth 148 at IEEE Applied Power Electronics Conference and Exposition (APEC 2019) at the Anaheim Convention Center in Anaheim, CA (19-20 March), StratEdge is focusing on high-power semiconductor package design and assembly. On display will be the LL family of leaded laminate copper-moly-copper (CMC) base packages and its off-the-shelf line of molded ceramic packages that can be configured to meet the requirements for chips with frequencies up to 18GHz. These packages provide enhanced thermal dissipation for high-power GaN devices and come in fully hermetic versions in over 200 standard outlines.

In booth 205 at the annual Government Microcircuit Applications and Critical Technology conference (GOMACTech 2019) at the Albuquerque Convention Center in Albuquerque, NM (26-27 March), StratEdge is highlighting high-reliability packages that meet stringent military applications. Operating from DC to 63+GHz, the firm’s post-fired and molded ceramic semiconductor packages have patented electrical transition designs that ensure exceptionally low electrical losses and operate efficiently, even at the highest frequencies. All packages are lead-free and most meet RoHS and WEEE standards.

“Our goal at StratEdge is not only to provide the highest quality and reliability packages and packaging assembly services, but we want to ensure that the package [that] a customer selects is the best one for the device that’s packaged and the application,” says president Tim Going.

See related items:

StratEdge opens new global HQ

StratEdge receives ISO 9001:2015 quality management system certification

Tags: StratEdge Power electronics

Visit:  www.apec-conf.org

Visit:  www.gomactech.net

Visit:  www.stratedge.com

Share/Save/Bookmark
See Latest IssueRSS Feed

EVG