ARM Purification

CLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIACLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIA

Join our LinkedIn group!

Follow ST on Twitter


18 March 2019

MACOM showcasing new RF products optimized for 5G connectivity and base stations at EDICON China

In booth #515 at the Electronic Design Innovation Conference (EDI CON China 2019) in the China National Convention Center in Beijing (1-3 April), MACOM Technology Solutions Inc is showcasing its high-performance RF portfolio, including monolithic microwave integrated circuits (MMICs), diodes, aluminium gallium arsenie (AlGaAs) switches, power amplifiers, front-end modules (FEMs) and gallium nitride (GaN) devices. The booth features new products optimized for 5G connectivity, wireless base-stations, radar, test & measurement, and industrial, scientific & medical (ISM) RF applications.

Specifically, MACOM is highlighting:

  • High-performance RF components: Showcasing MACOM’s high-performance portfolio serving diverse markets, test & measurement, satellite, radar, wired and wireless networks, automotive, industrial, medical and mobile devices;
  • 5G connectivity: Complete portfolio of high-performance and high-reliability wireless access front-end components and modules for 4G/5G;
  • Enabling the next generation of wireless base-stations: GaN-on-silicon 60W average power Doherty module;
  • RF energy: MACOM says that its GaN-on-Si portfolio delivers the performance, scale, supply security and surge capacity required for mainstream RF applications;
  • Cross-reference tools: MACOM’s cross-reference tools can assist in finding MACOM products that are a substitute or alternate replacement to other manufacturers.

MACOM staff are also participating in various events during EDICON, including Echo Cheng on the ‘State of GaN Technology Panel’ (Session T9-8, Room 206, on 2 April 2:35-4pm). Foundry and device manufacturers will review and debate the state of GaN manufacturing, covering topics such as reliability, advanced heat dissipation techniques, new packing innovations, silicon versus silicon carbide (SiC) substrates, millimeter-wave (mmWave) GaN devices, the use of GaN for various device types, and the state of GaN semiconductor production in China.

Tags: M/A-COM GaN-on-Si

Visit:  www.ediconchina.com

Visit:  www.macom.com

See Latest IssueRSS Feed