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5 February 2019

Aehr showcasing test & reliability qualification equipment at Photonics West

In booth 4046 at the SPIE Photonics West 2019 event at the Moscone Convention Center in San Francisco (5–7 February), Aehr Test Systems of Fremont, CA, USA, a supplier of test and reliability qualification equipment, is showcasing its next-generation solutions for functional test and early failure rate (EFR) test of optical devices in wafer, panel, singulated die or module form, including its FOX-XP system for high-volume production and its new FOX-NP low-cost, small-footprint entry-level system. In addition to functional test and reliability screening, the FOX systems provide the ability to stabilize laser optical performance (critical for the photonics market).

“We are very optimistic about the silicon photonics and photonics sensors markets and believe they will be significant growth drivers for Aehr,” says president & CEO Gayn Erickson. Market research firm Yole Développement predicts that silicon photonics technology will grow from being used in a few percent of the total optical transceiver market in 2016 to 35% of the market in 2025, with a market value for transceivers of almost $4bn in 2025.

“The rapid growth of integrated optical devices in high-performance servers and data centers, mobile devices, automotive applications and now wearable biosensors is driving substantially higher requirements for initial quality and long-term reliability, and the requirements are increasing with every new product generation,” Erickson adds. “These new applications are driving an entirely new level of quality and reliability expectation for these systems and pose a significant long-term growth opportunity for Aehr.”

The FOX-P Platform is Aehr’s next-generation multi-wafer and singulated die/module test solution that is capable of functional test and burn-in/cycling of photonics devices, flash memories, microcontrollers, sensors and other leading-edge ICs before they are assembled into single- or multi-die stacked packages. The FOX wafer-level systems utilize Aehr’s FOX WaferPak contactors, which provide cost-effective solutions for making electrical contact with a full wafer or substrate in a multi-wafer environment. The configuration with the DiePak Carriers enables burn-in of singulated die and multi-die modules to screen for defects in both the die and the module assembly process. The resulting known-good die, single-die or stacked-die packaged parts can then be used for high-reliability and quality applications such as enterprise solid-state drives, automotive devices, highly valuable mobile applications, and mission-critical integrated circuits and sensors.

The key features of the FOX-P Platform that contribute to cost-effectiveness include the ability to provide up to 2048 ‘Universal Channels’ per wafer or DiePak carrier, which allows the system to test all the devices on the wafer or DiePak carrier in parallel. The innovative Universal Channel architecture allows any channel to be any function: I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU). This enhanced architecture now allows customers to perform per-pin parametric testing, more extensive digital pattern test with deeper data stimulus/capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing. A single FOX-XP test system may be configured with up to 18 blades of wafer test resources, enabling up to 18 wafers to be tested simultaneously. The footprint of the 18-wafer test system is similar to the footprint of typical automatic test equipment (ATE) that can only test one wafer at a time. The highly integrated 2-blade FOX-NP system has a very small footprint and is designed to be easily integrated into product design, reliability and test lab applications.

Tags:  Semiconductor test instrument

Visit:  http://spie.org/photonics-west.xml

Visit:  www.aehr.com

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