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29 April 2019

StratEdge highlights high-frequency, thermally efficient packages at CS ManTech

In booth 305 at the International Conference on Compound Semiconductor Manufacturing Technology (CS ManTech 2019) in Minneapolis, MN (29 April-1 May), StratEdge of San Diego, CA, USA is displaying its thermally efficient packages for compound semiconductor devices such as gallium nitride (GaN) and gallium arsenide (GaAs), which enable them to meet the critical requirements of markets such as telecom, mixed-signal, VSAT, broadband wireless, satellite, military, test & measurement, automotive, down-hole, and MEMS.

StratEdge uses hardened, or post-fired, ceramic that does not shrink, resulting in complete dimensional stability and precise mechanical tolerances. The firm then mates these ceramics with its patented electrical transition designs to manufacture packages with exceptionally low electrical losses that operate efficiently, even at frequencies as high as 63+GHz. StratEdge offers complete automated assembly services for these packages, including gold-tin solder die attach.

“StratEdge was one of the first companies to make packages for compound semiconductors and has regularly attended CS ManTech since its inception,” notes president Tim Going. “Over the years, our patented technology has delivered superior electrical performance for GaN, GaAs and other compound semiconductor devices while providing mechanical stability for these sensitive devices,” he adds.

Tags: StratEdge Power electronics

Visit:  www.csmantech.org

Visit:  www.stratedge.com

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