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3 September 2018

MACOM to demo first complete chipset for 200G and 400G CWDM modules

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

In booth #1A32 at the China International Optoelectronic Exposition (CIOE 2018) in Shenzhen, China (5–8 September) and in booth #579 at the European Conference on Optical Communication (ECOC 2018) in Rome, Italy (24–26 September), MACOM Technology Solutions Holdings Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for RF, microwave, millimeter-wave and lightwave applications) is giving live demonstrations of what it claims is the first complete chipset solution for 200G and 400G CWDM optical module providers servicing cloud data-center applications. This enables 200G modules at under 4.5W and 400G modules at under 9W total power consumption, delivering what is reckoned to be industry-leading power efficiency with a fully analog architecture that ensures extremely low latency, as well as providing a lower-cost option compared to digital signal processor (DSP)-based offerings.

MACOM’s full transmit and receive solution operates at up to 53Gbps PAM-4 data rates per lane and is optimized for use in 200G QSFP56 and 400G QSFP-DD and OSFP module applications. For 200G demonstration, the solution consists of the MAOM-38051 four-channel transmit CDR (clock/data recovery) and modulator driver and MAOT-025402 transmitter optical subassembly (TOSA) with embedded MAOP-L284CN CWDM L-PIC (silicon photonic integrated circuit with integrated CW lasers) transmitter, and on the receive side it features the MAOR-053401 receiver optical subassembly (ROSA) with embedded demultiplexer, BSP56B photodetectors MATA-03819 quad transimpedance amplifier (TIA) and the MASC-38040 four-channel receive CDR. The combined high-performance MACOM solution enables a low bit error rate (BER) and better than 1E-8 pre-forward error correction (pre-FEC).

“MACOM is committed to leading the evolution of data-center interconnects from 100G to 200G and 400G, as evidenced by our unique ability to deliver a complete 200G chipset and TOSA/ROSA subassembly solution with market-leading performance and power efficiency,” says Gary Shah, VP, High-Performance Analog business line. “With this solution, optical module providers are expected to benefit from seamless component interoperability and a unified support team, reducing design complexity and costs while accelerating their time to market.”

All of the MACOM products highlighted in the 200G live demonstrations are sampling now, with production availability targeted for early 2019. Customers can select from component-level solutions or a TOSA/ROSA subassembly-level solution.

Tags: M/A-COM

Visit: www.cioe.cn/en

Visit: www.ecocexhibition.com

Visit: www.macom.com

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