, StratEdge displaying DC-63GHz packages at IMAPS Device Conference



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1 March 2018

StratEdge displaying DC-63GHz packages at IMAPS Device Conference

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

StratEdge of San Diego, CA, USA (which designs and manufactures packages and provides chip assembly & test services for microwave, millimeter-wave and high-speed digital devices) is displaying its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference at WekoPa Resort and Casino in Fountain Hills, Arizona (6-7 March).

StratEdge packages come in leaded and leadless drop-in formats, leaded and leadless surface-mount formats, and specialty high-power and high-speed digital designs. Packages on display include:

  • new, off-the-shelf molded ceramic packages that meet the requirements to handle 18GHz devices, including gallium nitride (GaN);
  • LL family of high-power laminate copper-moly-copper (CMC) base packages with a ratio of 1:3:1 CMC that include both GaN transistor and MMIC device packages;
  • SE50 series with what is claimed to be the industry’s lowest-electrical-loss design for compound semiconductors operating at frequencies as high as 63GHz;
  • MC Series of molded ceramic packages in standard, open-tooled configurations, which are all MIL-STD hermetic;
  • leaded power amplifier packages for gallium arsnide (GaAs) power amplifiers (a proven design that has been used in many point-to-point, point-to-multipoint and VSAT applications);
  • hermetic SMT packages in some of the most popular industry-standard, no-lead outlines for use where standard plastic packages cannot meet the reliability or performance requirements of a particular application;
  • high-speed digital and mixed-signal packages that can be customized for speeds in excess of 40GB/s.

“5G, and its high-power infrastructure, and IoT and advanced cellular technologies requiring RF and microwave frequencies will make package selection critical,” says president Tim Going. "Packages can no-longer be an after-thought. They not only are necessary for heat dissipation, but also to ensure that the electrical connection is accurate and the device functions as intended, without electrical losses,” he adds.

Tags: StratEdge

Visit: www.stratedge.com

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