- News
9 March 2018
Samsung enhances chip-scale LED package lineup with highest luminous efficacies
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Samsung Electronics Co Ltd of Seoul, South Korea has achieved what is claimed to be the industry’s highest luminous efficacies for its fillet-enhanced chip-scale package (FEC) LED lineup – LM101B, LH181B and LH231B.
Initially chip-scale package (CSP) LEDs were not widely used in mainstream LED lighting markets due to relatively low efficacy levels compared with conventional LED packages. However, the newly upgraded FECs can be applied to most mainstream LED lighting environments, including ambient, downlight, spotlight, high-bay, canopy and street-lighting applications.
“Since introducing CSP technology to the industry in 2014, we have put extensive effort into advancing the performance levels and design flexibility of every one of our CSP LEDs,” says Yoonjoon Choi, VP of the LED business team.
The enhanced FEC LEDs are based on Samsung’s most up-to-date CSP technology, which builds titanium dioxide (TiO2) walls around the side surfaces of the chip to direct light output upwards. The technology is said to provide considerably higher light efficacy than conventional CSP LEDs while offering greater flexibility for luminaire designers. Moreover, dramatically reduced cross-talk between neighboring packages allows each package to be placed in close proximity to each other.
Building on these advances, the revamped FEC LED packages achieve what is claimed to be the industry’s highest light efficacy levels, to suit a wider range of lighting applications. The LM101B features an increased efficacy of 205lm/W (65mA, CRI 80+, 5000K), which is said to be the highest among 1W-class, mid-power CSP LEDs. The 3W-class LH181B is said to provide the highest light efficacy in its class at 190lm/W (350mA, CRI 70+, 5000K), which represents a more than 10% enhancement over the previous version. The 5W-class LH231B package continues to offer 170lm/W (700mA, CRI 70+, 5000K), which is claimed to be the highest efficacy for the 5W class.
Samsung says that, due to the FEC’s small form factor and reduced cross-talk, the LM101B is particularly suited to spotlighting applications where packages can be densely placed within a small light-emitting surface area. The firm also made the LM101B much simpler to mount (compared with other mid-power CSP LEDs) by modifying the electrode pad.
In addition, the LH181B operates at a maximum current of 1.4A, making it suitable for high-power LED luminaires requiring superior lumen density, says the firm.
Now in mass production, the FEC lineup is available in a full range of correlated color temperature (CCT) and color rendering index (CRI) options. Samsung is showcasing its complete lineup in booth B04 (hall 6.2) at the Light + Building 2018 trade show in Frankfurt, Germany (18-23 March).
Samsung launches fillet-enhanced chip-scale LED packages for spotlights and high-bay applications
Samsung launches full line-up of CSP-based LED components
Samsung unveils ultra-compact second-generation CSP technology for LED lighting
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