, Oclaro expands component and module portfolio into L-band to boost data-center interconnects to 600G

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8 March 2018

Oclaro expands component and module portfolio into L-band to boost data-center interconnects to 600G

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

Oclaro Inc of San Jose, CA, USA (which provides components, modules and subsystems for optical communications) is developing a suite of integrated optical components and modules in the L-band to allow data-center customers to expand capacity on interconnects between data centers on existing optical fiber.

Enabling transmission up to 600Gbps per wavelength for long-haul, regional, metro and data-center interconnect applications, the portfolio includes a 64Gbaud micro-intradyne coherent receiver (micro-ICR), 32 and 64Gbaud integrated coherent transmitter (ICT), 100kHz micro-integrated tunable laser assembly (micro-ITLA), a 64Gbaud high-bandwidth co-packaged driver modulator (HB-CDM), and a high-bandwidth LiNbO3 polarization-multiplexed quad Mach-Zehnder (PM-QMZ) modulator.

“Historically, the requirement for L-band components has been largely driven by networks based on dispersion-shifted fiber,” says Beck Mason, president of Oclaro’s Integrated Photonic business. “Recently C+L band systems have been gaining popularity for data-center interconnect applications to maximize the use of existing fiber plant,” he adds. “Oclaro is applying its world-class photonic integration and packaging expertise to develop a broad portfolio of L-band solutions.”

The L-band micro-ITLA complies with the Optical Internetworking Forum (OIF) micro-ITLA Implementation Agreement and uses Oclaro’s thermally tuned digital supermode-distributed Bragg reflector (DS-DBR) laser technology to reduce low-frequency phase noise and linewidth while also increasing optical output power, all contained in a reduced size footprint.

The L-band HB-CDM complies with the OIF HB-CDM Implementation Agreement and uses Oclaro’s high-bandwidth L-band indium phosphide (InP) PM-QMZ modulator chip with a co-packaged matched RF driver. Flexible optical power and high linearity is achieved through the use of semiconductor optical amplifiers (SOAs) integrated within the InP modulator chip.

The high-bandwidth L-band LiNbO3 PM-QMZ modulator is already released to production.

The L-band 64Gbaud+ ICT combines a narrow-linewidth L-band laser with a high-bandwidth L-band PM-QMZ Mach-Zehnder modulator to support flexible baud rates up to 64Gbaud and 64-QAM modulation. This enables transmission from 100Gbp/s to 600Gbps. Built-in SOAs, tunable filter and polarization multiplexer eliminate the need for external optical components and simplify assembly while enabling operation in colorless networks. The ICT provides a local oscillator output with +12dBm EOL power for a mated coherent receiver.

The L-band 64-Gbaud+ ICR is a fully integrated coherent receiver able to support flexible data rates from 100Gbp/s to 600G+. It supports rates up to 64Gbaud with modulation schemes such as 64-QAM. The 64Gbaud ICR has an integrated monitor photodiode (MPD) and variable optical attenuators (VOA) to support single-channel and multi-channel applications in colorless networks. It is compliant with the form factor specified in the OIF Implementation Agreement OIF-DPC-MRX-01.0

The compact form factors and integrated functionality of the L-band 64Gbaud ICT-ICR pair make them suitable for the stringent size requirements on next-generation high-density 600Gbps platforms.

Oclaro is showcasing its suite of integrated optical components in booth #2812 at the Optical Networking and Communication Conference & Exhibition (OFC 2018) in San Diego, CA, USA (11-15 March).

See related items:

Oclaro launches suite of integrated optical components for 400G and 600G networks

Tags: Oclaro InP

Visit: www.ofcconference.org/

Visit: www.oclaro.com

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