, Oclaro samples first ultra-high-bandwidth 1310nm DFB-MZ PICs for select 100G/400G PAM4 applications

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6 March 2018

Oclaro samples first ultra-high-bandwidth 1310nm DFB-MZ PICs for select 100G/400G PAM4 applications

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

Oclaro Inc of San Jose, CA, USA (which provides components, modules and subsystems for optical communications) is sampling what is claimed to be the first family of high-bandwidth 1310nm photonic integrated circuits (PICs) that integrate a distributed feedback (DFB) laser with a Mach-Zehnder (MZ) modulator for intra-data-center applications using CWDM wavelengths. Leveraging Oclaro’s expertise in 1310 DFB lasers for shorter-reach applications with its indium phosphide (InP) high-bandwidth modulator technology, the new family of chips will enable higher-speed connectivity across data-center campuses.

The 1310nm DFB-MZ PIC has been engineered to address the most challenging configurations where high bandwidth and optical signal purity are critical to overcome potential fiber and connector impairments. The new product complements Oclaro’s full suite of InP directly modulated laser (DML) and electro-absorption modulated lasers (EMLs), all specifically designed to address data-center single-mode fiber infrastructure requirements.

“The need for ever-increasing capacity within the data center is making it critical to develop higher-speed and more integrated component technology,” says Beck Mason, president of Oclaro’s Integrated Photonic business. “Oclaro has a long history of delivering proven direct-detect and coherent technology and we are pleased to be the first supplier to now offer a 1310nm DFB-MZ PIC capable of supporting the demanding 100Gbps per wavelength PAM4 (4-level pulse amplitude modulation) applications.”

The 1310nm DFB-MZ PICs take advantage of proven elements that have been in production at Oclaro for many years, including DFB lasers and PICs with integrated Mach-Zehnder modulators, all based on InP. These elements are brought together to form a new PIC to tackle the complex task of high data rate, high extinction ratio and good linearity for PAM4 modulation. The PICs are available in 50Gbps per wavelength and higher-bandwidth 100Gbps per wavelength versions supporting all four CWDM fixed wavelengths.

Oclaro’s family of DFB-MZ chips are sampling now, with volume production expected by July.

Oclaro is showcasing its product portfolio in booth #2812 at the Optical Networking and Communication Conference & Exhibition (OFC 2018) in San Diego, CA, USA (11-15 March).

Tags: Oclaro InP

Visit: www.ofcconference.org/

Visit: www.oclaro.com

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