7 March 2018
MRSI Systems’ new MRSI-HVM3 die bonder enters volume production
© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.
MRSI Systems of North Billerica, MA, USA (which makes fully automated, high-precision, high-speed die bonding and epoxy dispensing systems) says that its new MRSI-HVM3 system - launched at the 19th China International Optoelectronics Exposition (CIOE 2017) in Shenzhen (6-9 September) - has entered volume production, using Demand Flow Technology (DFT) to satisfy worldwide customer demand.
The first wave of configured MRSI-HVM3 systems has been focused on chip-on-submount (CoS), chip-on-carrier (CoC), and chip-on-baseplate (CoB) processes, and have been installed in North America, Europe and Asia.
“Our new 3µm high-speed die bonder MRSI-HVM3 is exactly the solution the photonics market was looking for to address one of the most critical manufacturing bottlenecks,” says Dr Yi Qian, VP of product management. “We listened to our customers and prospects and geared the roadmap towards the direction of high speed without sacrificing high accuracy, or high flexibility, to handle multi-chip multi-process production in one machine. As a result, the system is able to generate a great return on investment,” he claims.
The new system helps photonic device companies to execute their strategy to have a fast-response high-volume manufacturing capability alongside the ability to maintain low manufacturing costs for the high demand driven by data-center applications, the firm says. “We also predicted the new system would need to allow the production of multiple products passing through the same production line without sacrificing throughput,” says Qian. “Our assumptions have been validated by this first wave of customers with their test results on their facility floors.”
MRSI Systems is exhibiting in booth #4444 at the Optical Networking and Communication Conference & Exhibition (OFC 2018) in San Diego, CA, USA (13-15 March).