- News
8 March 2018
MACOM showcasing RF portfolio of MMICs, diodes and GaN-on-Si devices at EDICON
© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.
In booth #418 at the Electronic Design Innovation Conference (EDI CON China 2018) at the China National Convention Center in Beijing (20-22 March), MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for RF, microwave, millimeter-wave and lightwave applications) is showcasing its RF portfolio of MMICs, diodes and GaN-on-silicon devices, as follows:
- MATK-102425-300: RF Energy Toolkit live demonstration;
- RF Plasma ‘Torch’ live demonstration;
- new silicon-based solutions for high-performance narrowband voltage-controlled oscillator (VCO) portfolio’;
- complete portfolio of wireless access front-end components and modules for 4G and 5G applications;
- compact Tx and Rx front-end modules (FEMs) for 5G M-MIMO applications; and
- high-power PIN diode switches.
Also, MACOM representatives will be present at the following workshops and panels:
- 20 March (2:15pm) –5G Massive MIMO Panel By Microwave Journal – Anthony Fischetti;
- 20 March (4:30pm) – AM/PM Distortion of GaN HEMT Workshop – Mengsu Yang;
- 21 March (1:05pm) – GaN Technology Panel Session By Microwave Journal – Michael Ziehl;
- 22 March (9:05am) – The Solid State RF Energy – Inroads to the Industrial Market Panel– Mark Murphy.
 
    














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©2006-2020
    Juno Publishing and Media Solutions Ltd. All rights reserved. Semiconductor
    Today and the editorial material contained within it and related media is
    the copyright of Juno Publishing and Media Solutions Ltd. Reproduction in
    whole or part without permission from Juno Publishing and Media Solutions
    Ltd is forbidden. In most cases, permission will be granted, if the magazine
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