, II-VI launches bi-directional optical line subsystem platform for data-center interconnects



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12 March 2018

II-VI launches bi-directional optical line subsystem platform for data-center interconnects

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

Engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA has introduced a bi-directional optical line subsystem (Bi-Di OLS) platform for data-center interconnects (DCI), optimized for direct-detect DWDM transceivers including the new COLORZ-Lite 100G PAM4 based on the COLORZ silicon photonics platform from Inphi Corp of Santa Clara, CA, USA (a provider of high-speed mixed-signal ICs for communications, computing and data-center markets).

Cloud service providers require increasingly scalable, cost-effective and power-efficient solutions to meet the rapidly growing demand for data-center interconnects, notes II-VI. The firm’s previously announced OLS, together with COLORZ-Lite data streams, enable data-center operators to achieve a combined transmission rate of up to 4Tb/s over a 25km reach, in a compact one rack unit (1RU) form factor, over a pair of fibers. The new Bi-Di OLS operates over only one fiber, doubling fiber utilization efficiency.

“Our Bi-Di OLS leverages II-VI’s broad portfolio of products, including multi-port mux/demux filters, amplifiers, circulators and monitoring modules, to achieve a highly vertically integrated and cost-efficient solution,” says Dr Sanjai Parthasarathi, VP, product marketing & strategy, Optical Communications Group. “Inphi’s COLORZ-Lite direct-detect transceivers are a perfect complement to the Bi-Di OLS,” he comments.

“Inphi has been deploying COLORZ at scale for data-center interconnects, and we are now pleased to extend our capabilities for bi-directional single-fiber applications,” comments Dr Loi Nguyen, founder & senior VP, Optical Interconnect, at Inphi. “COLORZ 100G DWDM technology continues to enable cloud network operators to reduce their total cost of ownership.”

The II-VI Bi-Di OLS and the COLORZ-Lite 100G PAM4 platforms are being jointly demonstrated in II-VI’s booth #2313 at the Optical Fiber Communication Conference & Exhibition (OFC 2018) in San Diego, CA, USA (13-15 March).

At OFC, II-VI is showcasing new products that are driven by advances in its materials and technology platforms to enable next-generation optical networks. The product showcase includes a broad portfolio of products for reconfigurable optical add-drop multiplexer (ROADM) line cards, highly compact optical amplifier solutions tailored to enable high-bit-rate DWDM transceivers, micro-optics assemblies for CATV networks, micro-optics and optoelectronics for data-center transceivers, indium phosphide (InP)-based epiwafers, and thermo-electric solutions.

Tags: II-VI Inc

Visit: www.ofcconference.org/

Visit: www.ii-vi-photonics.com

Visit: www.inphi.com

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